MURA230T3, MURA240T3
Preferred Devices
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
http://onsemi.com
Features
ULTRAFAST RECTIFIERS
2 AMPERES, 300−400 VOLTS
• Small Compact Surface Mountable Package with J−Bend Leads
• Rectangular Package for Automated Handling
• High Temperature Glass Passivated Junction
• Low Forward Voltage Drop (0.95 V Max @ 2.0 A, T = 150°C)
J
• Pb−Free Packages are Available
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 70 mg (Approximately)
SMA
CASE 403D
STYLE 1
PLASTIC
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
MARKING DIAGRAM
• Polarity: Polarity Band Indicates Cathode Lead
• ESD Protection: Human Body Model > 4000 V (Class 3)
Machine Model > 400 V (Class C)
U5x
AYWW G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
V
V
RRM
U5Fx = Device Code
x = F for MURA230T3
G for MURA240T3
V
RWM
V
DC Blocking Voltage
MURA230T3
MURA240T3
300
400
R
A
Y
= Assembly Location
= Year
Average Rectified Forward Current
I
A
A
F(AV)
@ T = 150°C
1.0
2.0
L
WW = Work Week
G
@ T = 125°C
L
= Pb−Free Package
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
35
FSM
ORDERING INFORMATION
Operating Junction Temperature Range
T
−65 to +175
°C
J
†
Device
Package
Shipping
THERMAL CHARACTERISTICS
MURA230T3
SMA
5000/Tape & Reel
5000/Tape & Reel
Characteristic
Symbol
Value
Unit
MURA230T3G
SMA
(Pb−Free)
Thermal Resistance, Junction−to−Lead
Psi
24
°C/W
JL
(T = 25°C) (Note 1)
(Note 2)
R
L
Thermal Resistance, Junction−to−Ambient
(Note 1)
q
JA
MURA240T3
SMA
5000/Tape & Reel
5000/Tape & Reel
216
MURA240T3G
SMA
(Pb−Free)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Rating applies when surface mounted on the minimum pad size
recommended, PC Board FR−4.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
2. In compliance with JEDEC 51, these values (historically represented by R
)
q
JL
Preferred devices are recommended choices for future use
and best overall value.
are now referenced as Psi
.
JL
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 3
MURA230T3/D