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SURA8260T3G-GA01 PDF预览

SURA8260T3G-GA01

更新时间: 2024-11-22 11:01:31
品牌 Logo 应用领域
安森美 - ONSEMI 整流二极管
页数 文件大小 规格书
4页 49K
描述
Power Rectifier, Ultra-Fast Recovery, 2 A, 600 V

SURA8260T3G-GA01 数据手册

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MURA260T3  
Preferred Device  
Surface Mount  
Ultrafast Power Rectifier  
Ideally suited for high voltage, high frequency rectification, or as  
free wheeling and protection diodes in surface mount applications  
where compact size and weight are critical to the system.  
http://onsemi.com  
Features  
Small Compact Surface Mountable Package with J−Bend Leads  
Rectangular Package for Automated Handling  
ULTRAFAST RECTIFIER  
2 AMPERES, 600 VOLTS  
High Temperature Glass Passivated Junction  
Low Forward Voltage Drop (1.2 V Max @ 2.0 A, T = 150°C)  
J
Pb−Free Package is Available  
Mechanical Characteristics:  
Case: Epoxy, Molded  
Weight: 70 mg (Approximately)  
SMA  
CASE 403D  
PLASTIC  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
MARKING DIAGRAM  
Polarity: Polarity Band Indicates Cathode Lead  
ESD Protection: Human Body Model > 4000 V (Class 3)  
Machine Model > 400 V (Class C)  
U5J  
AYWW G  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
600  
V
RRM  
V
RWM  
V
U5J = Device Code  
R
A
Y
= Assembly Location  
= Year  
Average Rectified Forward Current  
I
A
A
F(AV)  
@ T = 145°C  
1.0  
2.0  
L
WW = Work Week  
@ T = 110°C  
L
G
= Pb−Free Package  
Non-Repetitive Peak Surge Current  
(Surge Applied at Rated Load Conditions  
Halfwave, Single Phase, 60 Hz)  
I
30  
FSM  
ORDERING INFORMATION  
Operating Junction Temperature Range  
T
−65 to +175  
°C  
J
Device  
Package  
Shipping  
THERMAL CHARACTERISTICS  
MURA260T3  
SMA  
5000/Tape & Reel  
5000/Tape & Reel  
Characteristic  
Symbol  
Value  
Unit  
MURA260T3G  
SMA  
(Pb−Free)  
Thermal Resistance, Junction−to−Lead  
Psi  
24  
°C/W  
JL  
(T = 25°C) (Note 1)  
Thermal Resistance, Junction−to−Ambient  
(Note 1)  
(Note 2)  
R
L
216  
q
JA  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
Preferred devices are recommended choices for future use  
1. Rating applies when surface mounted on the minimum pad size recommended,  
PC Board FR−4.  
and best overall value.  
2. In compliance with JEDEC 51, these values (historically represented by R  
)
q
JL  
are now referenced as Psi  
.
JL  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 − Rev. 3  
MURA260T3/D  
 

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