MURD320, SURD8320,
NRVUD320W1
Switch-mode Power
Rectifier
DPAK Surface Mount Package
www.onsemi.com
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
ULTRAFAST RECTIFIER
3.0 AMPERES, 200 VOLTS
Features
• Ultrafast 35 Nanosecond Recovery Time
• Low Forward Voltage Drop
• Low Leakage
• SURD8, NRVUD Prefixes for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable
DPAK
CASE 369C
• These Devices are Pb−Free and are RoHS Compliant*
1
3
1
3
Mechanical Characteristics
4
4
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
STYLE 3
STYLE 8
MARKING DIAGRAM
• Lead and Mounting Surface Temperature for Soldering Purposes:
AYWW
U
320G
AYWW
260°C Max. for 10 Seconds
U
• ESD Ratings:
320W1G
♦ Machine Model = C (> 400 V)
♦ Human Body Model = 3B (> 8 kV)
MURD320T4G
SURD8320T4G
NRVUD320T4G
A
Y
= Assembly Location
= Year
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
WW = Work Week
= Pb−Free Package
G
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
200
V
V
RWM
V
R
ORDERING INFORMATION
Average Rectified Forward Current
I
A
A
F(AV)
(Rated V , T = 158°C)
3.0
6.0
†
R
C
Device
Package
Shipping
Peak Repetitive Forward Current
(Rated V , Square Wave, 20 kHz,
I
FRM
MURD320T4G
DPAK
(Pb−Free)
2500 / Tape &
Reel
R
T
C
= 158°C)
SURD8320T4G
NRVUD320W1T4G
DPAK
(Pb−Free)
2500 / Tape &
Reel
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, 60 Hz)
I
A
FSM
75
DPAK
(Pb−Free)
2500 / Tape &
Reel
Operating Junction and Storage
Temperature Range
T , T
J
−65 to +175
°C
stg
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
May, 2015 − Rev. 9
MURD320/D