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STD5406NT4G PDF预览

STD5406NT4G

更新时间: 2024-11-03 01:16:03
品牌 Logo 应用领域
安森美 - ONSEMI 开关脉冲晶体管
页数 文件大小 规格书
6页 82K
描述
Power MOSFET

STD5406NT4G 技术参数

是否无铅: 不含铅生命周期:End Of Life
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
Factory Lead Time:1 week风险等级:5.3
雪崩能效等级(Eas):450 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏极电流 (Abs) (ID):70 A最大漏极电流 (ID):70 A
最大漏源导通电阻:0.01 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):300 pFJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):100 W最大脉冲漏极电流 (IDM):150 A
参考标准:AEC-Q101子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

STD5406NT4G 数据手册

 浏览型号STD5406NT4G的Datasheet PDF文件第2页浏览型号STD5406NT4G的Datasheet PDF文件第3页浏览型号STD5406NT4G的Datasheet PDF文件第4页浏览型号STD5406NT4G的Datasheet PDF文件第5页浏览型号STD5406NT4G的Datasheet PDF文件第6页 
NTD5406N, STD5406N  
Power MOSFET  
40 V, 70 A, Single N−Channel, DPAK  
Features  
Low R  
DS(on)  
High Current Capability  
Low Gate Charge  
STD Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
www.onsemi.com  
I
MAX  
D
V
R
TYP  
DS(ON)  
(Note 1)  
(BR)DSS  
40 V  
8.7 mΩ @ 10 V  
70 A  
These Devices are Pb−Free and are RoHS Compliant  
D
Applications  
Electronic Brake Systems  
Electronic Power Steering  
Bridge Circuits  
N−Channel  
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
40  
Unit  
V
4
DPAK  
CASE 369C  
STYLE 2  
V
DSS  
2
1
Gate−to−Source Voltage  
V
GS  
20  
V
3
Continuous Drain  
Current − R  
T
= 25°C  
I
D
70  
A
C
Steady  
State  
JC  
MARKING DIAGRAM  
T
C
= 125°C  
40  
Power Dissipation −  
R
Steady  
State  
P
100  
W
A
D
T
= 25°C  
1
C
AYWW  
54  
06NG  
JC  
Continuous Drain  
Current − R  
Steady  
State  
T = 25°C  
A
I
D
12.2  
7.0  
JA  
T = 125°C  
A
(Note 1)  
A
Y
= Assembly Location*  
= Year  
= Work Week  
Power Dissipation −  
Steady  
State  
T = 25°C  
P
3.0  
W
A
D
R
(Note 1)  
JA  
WW  
5406N = Specific Device Code  
= Pb−Free Device  
Pulsed Drain Current  
t = 10 s  
p
I
150  
A
DM  
G
Operating Junction and Storage Temperature  
T ,  
−55 to  
175  
°C  
J
T
STG  
* The Assembly Location code (A) is front side  
optional. In cases where the Assembly Location is  
stamped in the package, the front side assembly  
code may be blank.  
Source Current (Body Diode) Pulsed  
I
S
63.5  
450  
A
Single Pulse Drain−to Source Avalanche  
EAS  
mJ  
Energy − (V = 50 V, V = 10 V, I = 30 A,  
DD  
GS  
PK  
L = 1 mH, R = 25 )  
G
ORDERING INFORMATION  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
260  
°C  
T
L
Device  
Package  
Shipping†  
NTD5406NT4G  
DPAK  
(Pb−Free)  
2500 / Tape &  
Reel  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
STD5406NT4G*  
DPAK  
(Pb−Free)  
2500 / Tape &  
Reel  
THERMAL RESISTANCE RATINGS (Note 1)  
STD5406NT4G−VF01  
DPAK  
(Pb−Free)  
2500 / Tape &  
Reel  
Parameter  
Junction−to−Case (Drain)  
Junction−to−Ambient (Note 1)  
Symbol  
Max  
1.5  
49  
Unit  
R
R
°C/W  
θ
JC  
JA  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
θ
1. Surface mounted on FR4 board using 1 sq in pad size,  
(Cu Area 1.127 sq in [2 oz] including traces).  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
November, 2016 − Rev. 8  
NTD5406N/D  
 

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