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STD110N02RT4G PDF预览

STD110N02RT4G

更新时间: 2024-11-25 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 晶体管功率场效应晶体管
页数 文件大小 规格书
8页 67K
描述
单 N 沟道,功率 MOSFET,24V,110A,4.6mΩ

STD110N02RT4G 数据手册

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NTD110N02R  
Power MOSFET  
24 V, 110 A, N−Channel DPAK  
Features  
Planar HD3e Process for Fast Switching Performance  
Low R  
to Minimize Conduction Loss  
DS(on)  
http://onsemi.com  
Low C to Minimize Driver Loss  
iss  
Low Gate Charge  
V
R
TYP  
I MAX  
D
(BR)DSS  
DS(on)  
Optimized for High Side Switching Requirements in  
High−Efficiency DC−DC Converters  
24 V  
4.1 mW @ 10 V  
110 A  
Pb−Free Packages are Available  
N−Channel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
Unit  
Drain−to−Source Voltage  
V
24  
V
V
DSS  
G
Gate−to−Source Voltage − Continuous  
Thermal Resistance − Junction−to−Case  
Total Power Dissipation @ T = 25°C  
V
±20  
GS  
R
P
1.35  
110  
°C/W  
W
q
JC  
S
C
D
Drain Current  
4
− Continuous @ T = 25°C, Chip  
I
I
110  
110  
A
A
C
D
− Continuous @ T = 25°C,  
C
D
D
D
Limited by Package  
4
− Continuous @ T = 25°C,  
I
I
32  
A
A
A
Limited by Wires  
1
2
1
− Single Pulse (t = 10 ms)  
110  
p
2
3
3
Thermal Resistance  
− Junction−to−Ambient (Note 1)  
R
P
I
52  
2.88  
17.5  
°C/W  
W
A
CASE 369D  
DPAK  
(Straight Lead)  
STYLE 2  
CASE 369AA  
DPAK  
(Surface Mount)  
STYLE 2  
q
JA  
Total Power Dissipation @ T = 25°C  
A
D
− Drain Current − Continuous @ T = 25°C  
A
D
Thermal Resistance  
− Junction−to−Ambient (Note 2)  
R
P
100  
1.5  
°C/W  
W
q
JA  
Total Power Dissipation @ T = 25°C  
MARKING DIAGRAM  
& PIN ASSIGNMENTS  
A
D
− Drain Current − Continuous @ T = 25°C  
I
D
12.5  
A
A
Operating and Storage  
Temperature Range  
T , T  
55 to  
175  
°C  
J
stg  
4
4
Drain  
Drain  
Single Pulse Drain−to−Source Avalanche  
E
AS  
120  
mJ  
Energy − Starting T = 25°C  
J
(V = 50 Vdc, V = 10 Vdc,  
DD  
GS  
I = 15.5 Apk, L = 1.0 mH, R = 25 W)  
L
G
Maximum Lead Temperature for Soldering  
T
L
260  
°C  
Purposes, (1/8from case for 10 s)  
2
1
Gate  
3
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
Drain  
Source  
1
2
3
Gate Drain Source  
Y
= Year  
= Work Week  
T110N2 = Device Code  
1. When surface mounted to an FR4 board using 0.5 sq in drain pad size.  
2. When surface mounted to an FR4 board using the minimum recommended  
pad size.  
WW  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
December, 2004 − Rev. 6  
NTD110N02R/D  
 

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