是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | HVSON, | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 12 weeks |
风险等级: | 5.68 | JESD-30 代码: | S-PDSO-N8 |
JESD-609代码: | e3 | 长度: | 2 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVSON | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
座面最大高度: | 0.4 mm | 标称供电电压: | 3.3 V |
表面贴装: | YES | 电信集成电路类型: | TELECOM CIRCUIT |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.4 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 2 mm | Base Number Matches: | 1 |
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2.4 GHz High-Gain, High-Efficiency Power Amplifier | |
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2.4 GHz High-Gain, High-Efficiency Power Amplifier | |
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