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SSS4N60AS PDF预览

SSS4N60AS

更新时间: 2024-11-04 03:30:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
7页 263K
描述
Advanced Power MOSFET

SSS4N60AS 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-220F包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:unknown
风险等级:5.27Is Samacsys:N
雪崩能效等级(Eas):260 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:600 V
最大漏极电流 (Abs) (ID):2.3 A最大漏极电流 (ID):2.3 A
最大漏源导通电阻:2.2 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSFM-T3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):33 W最大脉冲漏极电流 (IDM):16 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SSS4N60AS 数据手册

 浏览型号SSS4N60AS的Datasheet PDF文件第2页浏览型号SSS4N60AS的Datasheet PDF文件第3页浏览型号SSS4N60AS的Datasheet PDF文件第4页浏览型号SSS4N60AS的Datasheet PDF文件第5页浏览型号SSS4N60AS的Datasheet PDF文件第6页浏览型号SSS4N60AS的Datasheet PDF文件第7页 
SSS4N60AS  
Advanced Power MOSFET  
FEATURES  
BVDSS = 600 V  
Avalanche Rugged Technology  
Rugged Gate Oxide Technology  
Lower Input Capacitance  
W
RDS(on) = 2.2  
ID = 2.3 A  
Improved Gate Charge  
Extended Safe Operating Area  
TO-220F  
m
Lower Leakage Current : 25 A (Max.) @ VDS = 600V  
Lower RDS(ON) : 2.037 (Typ.)  
W
1
2
3
1.Gate 2. Drain 3. Source  
Absolute Maximum Ratings  
Symbol  
Characteristic  
Value  
Units  
VDSS  
Drain-to-Source Voltage  
Continuous Drain Current (TC=25oC)  
Continuous Drain Current (TC=100o  
V
600  
2.3  
1.5  
16  
ID  
A
)
C
IDM  
VGS  
EAS  
IAR  
Drain Current-Pulsed  
A
V
1
O
+
_
Gate-to-Source Voltage  
30  
2
O
Single Pulsed Avalanche Energy  
Avalanche Current  
260  
2.3  
3.3  
3.0  
33  
mJ  
A
1
O
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Total Power Dissipation (TC=25o  
mJ  
V/ns  
W
1
O
3
O
)
C
PD  
TJ , TSTG  
TL  
Linear Derating Factor  
0.26  
W/oC  
Operating Junction and  
Storage Temperature Range  
- 55 to +150  
300  
oC  
Maximum Lead Temp. for Soldering  
Purposes, 1/8 “ from case for 5-seconds  
Thermal Resistance  
Symbol  
Characteristic  
Typ.  
Max.  
Units  
R q  
--  
--  
3.79  
62.5  
Junction-to-Case  
JC  
oC/W  
Rq  
Junction-to-Ambient  
JA  
Rev. B  
©1999 Fairchild Semiconductor Corporation  

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