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SSM3K336R PDF预览

SSM3K336R

更新时间: 2024-11-30 12:56:03
品牌 Logo 应用领域
东芝 - TOSHIBA 转换器开关DC-DC转换器
页数 文件大小 规格书
9页 225K
描述
Power Management Switches DC-DC Converters

SSM3K336R 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-F3Reach Compliance Code:unknown
风险等级:5.74配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):3 A
最大漏源导通电阻:0.095 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL表面贴装:YES
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SSM3K336R 数据手册

 浏览型号SSM3K336R的Datasheet PDF文件第2页浏览型号SSM3K336R的Datasheet PDF文件第3页浏览型号SSM3K336R的Datasheet PDF文件第4页浏览型号SSM3K336R的Datasheet PDF文件第5页浏览型号SSM3K336R的Datasheet PDF文件第6页浏览型号SSM3K336R的Datasheet PDF文件第7页 
SSM3K336R  
MOSFETs Silicon N-Channel MOS  
SSM3K336R  
1. Applications  
Power Management Switches  
DC-DC Converters  
2. Features  
(1) 4.5 V gate drive voltage.  
(2) Low drain-source on-resistance  
: RDS(ON) = 95 m(max) (@VGS = 10 V)  
RDS(ON) = 140 m(max) (@VGS = 4.5 V)  
3. Packaging and Pin Configuration  
1. Gate  
2. Source  
3. Drain  
SOT-23F  
4. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
VDSS  
VGSS  
ID  
30  
±20  
(Note 1)  
(Note 1,2)  
(Note 3)  
(Note 3)  
3
A
IDP  
8
PD  
1
2
W
W
Power dissipation  
(t 10 s)  
PD  
Channel temperature  
Storage temperature  
Tch  
Tstg  
150  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Ensure that the channel temperature does not exceed 150.  
Note 2: Pulse width (PW) 10 ms, duty 1%  
Note 3: Device mounted on a FR4 board.(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2)  
2012-11-14  
Rev.1.0  
1

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