SN74LVC2G00
DUAL 2-INPUT POSITIVE-NAND GATE
www.ti.com
SCES193L–APRIL 1999–REVISED JANUARY 2007
FEATURES
•
Available in the Texas Instruments
NanoFree™ Package
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•
•
•
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
•
•
•
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Supports 5-V VCC Operation
Ioff Supports Partial-Power-Down Mode
Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 4.3 ns at 3.3 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
ESD Protection Exceeds JESD 22
–
–
2000-V Human-Body Model (A114-A)
1000-V Charged-Device Model (C101)
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
DCT PACKAGE
(TOP VIEW)
DCU PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
4 5
GND
2Y
2A
2B
VCC
1Y
2B
2A
1
2
3
4
8
7
6
5
1A
1B
VCC
1Y
2B
2A
1
2
3
4
8
7
6
5
1A
1B
3 6
2 7
1 8
1B
1Y
2Y
VCC
1A
GND
2Y
GND
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual 2-input positive-NAND gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G00 performs the Boolean function Y = A B or Y = A + B in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
Reel of 3000
SN74LVC2G00YZPR
_ _ _CA_
C00_ _ _
Reel of 3000
Reel of 3000
Reel of 250
SN74LVC2G00DCTR
SN74LVC2G00DCUR
SN74LVC2G00DCUT
–40°C to 85°C
VSSOP – DCU
C00_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.