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SN74LVC2G02 PDF预览

SN74LVC2G02

更新时间: 2024-11-19 23:06:23
品牌 Logo 应用领域
德州仪器 - TI 输入元件
页数 文件大小 规格书
12页 318K
描述
DUAL 2 INPUT POSITIVE NOR GATE

SN74LVC2G02 数据手册

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ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢇ  
ꢊꢋꢌ ꢄ ꢇ ꢍꢎꢁ ꢏꢋꢐ ꢏꢑ ꢀꢎ ꢐ ꢎꢅꢒ ꢍꢁꢑ ꢓ ꢈ ꢌꢐꢒ  
SCES194J − APRIL 1999 − REVISED SEPTEMBER 2003  
DCT OR DCU PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
Supports 5-V V  
Operation  
CC  
1A  
1B  
2Y  
V
CC  
1
2
3
4
8
7
6
5
Inputs Accept Voltages to 5.5 V  
1Y  
2B  
2A  
Max t of 4.9 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
GND  
CC  
24-mA Output Drive at 3.3 V  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
= 3.3 V, T = 25°C  
OLP  
CC  
A
D
D
D
D
Typical V  
(Output V  
Undershoot)  
4 5  
3 6  
2 7  
1 8  
GND  
2Y  
1B  
2A  
2B  
1Y  
OHV  
OH  
>2 V at V  
= 3.3 V, T = 25°C  
CC  
A
I
Supports Partial-Power-Down Mode  
off  
Operation  
1A  
V
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This dual 2-input positive-NOR gate is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC2G02 performs the Boolean function Y = A + B or Y = A B in positive logic.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC2G02YEAR  
SN74LVC2G02YZAR  
SN74LVC2G02YEPR  
SN74LVC2G02YZPR  
NanoFree− WCSP (DSBGA)  
0.17-mm Small Bump − YZA (Pb-free)  
Reel of 3000  
_ _ _CB_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
−40°C to 85°C  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
SSOP − DCT  
Reel of 3000  
Reel of 3000  
SN74LVC2G02DCTR  
SN74LVC2G02DCUR  
C02_ _ _  
C02_  
VSSOP − DCU  
Reel of 250  
SN74LVC2G02DCUT  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢐꢟ  
Copyright 2003, Texas Instruments Incorporated  
ꢛ ꢟ ꢜ ꢛꢔ ꢕꢩ ꢗꢖ ꢚ ꢢꢢ ꢠꢚ ꢘ ꢚ ꢙ ꢟ ꢛ ꢟ ꢘ ꢜ ꢤ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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