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SN74LVC2G04_10 PDF预览

SN74LVC2G04_10

更新时间: 2024-11-20 06:12:59
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德州仪器 - TI /
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DUAL INVERTER GATE

SN74LVC2G04_10 数据手册

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SN74LVC2G04  
DUAL INVERTER GATE  
www.ti.com  
SCES195LAPRIL 1999REVISED JANUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
Ioff Supports Partial-Power-Down Mode  
Operation  
Supports 5-V VCC Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Inputs Accept Voltages to 5.5 V  
Max tpd of 4.1 ns at 3.3 V  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
1000-V Charged-Device Model (C101)  
Typical VOLP (Output Ground Bounce) <0.8 V  
at VCC = 3.3 V, TA = 25°C  
Typical VOHV (Output VOH Undershoot) >2 V at  
VCC = 3.3 V, TA = 25°C  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
4
2Y  
2A  
GND  
1A  
1
2
3
6
5
4
1A  
GND  
2A  
1Y  
1A  
GND  
2A  
1Y  
1
2
3
6
5
4
1
2
3
6
1A  
GND  
2A  
1Y  
V
2
1
5
6
V
CC  
V
CC  
V
CC  
1Y  
2Y  
5
4
CC  
2Y  
2Y  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This dual inverter is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G04 performs the Boolean  
function Y = A.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
(Pb-free)  
Reel of 3000  
SN74LVC2G04YZPR  
_ _ _CC_  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
Reel of 4000  
SN74LVC2G04DBVR  
SN74LVC2G04DBVT  
SN74LVC2G04DCKR  
SN74LVC2G04DCKT  
SN74LVC2G04DRLR  
SOT (SOT-23) – DBV  
C04_  
–40°C to 85°C  
SOT (SC-70) – DCK  
CC_  
CC_  
SOT (SOT-563) – DRL  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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