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SN74LVC1G07DCKTG4 PDF预览

SN74LVC1G07DCKTG4

更新时间: 2024-11-20 11:49:15
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
18页 859K
描述
SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

SN74LVC1G07DCKTG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:TSSOP, TSSOP5/6,.08针数:5
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:1.69Samacsys Description:Buffer/Driver 1-CH Non-Inverting Open Drain CMOS 5-Pin SC-70 T/R
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G5
JESD-609代码:e4长度:2 mm
负载电容(CL):50 pF逻辑集成电路类型:BUFFER
最大I(ol):0.032 A湿度敏感等级:1
功能数量:1输入次数:1
端子数量:5最高工作温度:125 °C
最低工作温度:-40 °C输出特性:OPEN-DRAIN
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP5/6,.08封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TR
峰值回流温度(摄氏度):260电源:3.3 V
最大电源电流(ICC):0.01 mAProp。Delay @ Nom-Sup:4.7 ns
传播延迟(tpd):8.6 ns认证状态:Not Qualified
施密特触发器:NO座面最大高度:1.1 mm
子类别:Gates最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.65 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1.25 mm

SN74LVC1G07DCKTG4 数据手册

 浏览型号SN74LVC1G07DCKTG4的Datasheet PDF文件第2页浏览型号SN74LVC1G07DCKTG4的Datasheet PDF文件第3页浏览型号SN74LVC1G07DCKTG4的Datasheet PDF文件第4页浏览型号SN74LVC1G07DCKTG4的Datasheet PDF文件第5页浏览型号SN74LVC1G07DCKTG4的Datasheet PDF文件第6页浏览型号SN74LVC1G07DCKTG4的Datasheet PDF文件第7页 
SN74LVC1G07  
www.ti.com .................................................................................................................................................. SCES296WFEBRUARY 2000REVISED JUNE 2008  
SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT  
1
FEATURES  
2
Available in the Texas Instruments  
NanoFree™ Package  
Ioff Supports Partial-Power-Down Mode  
Operation  
Supports 5-V VCC Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Input and Open-Drain Output Accept  
Voltages up to 5.5 V  
ESD Protection Exceeds JESD 22  
Max tpd of 4.2 ns at 3.3 V  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
1000-V Charged-Device Model (C101)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
1
2
3
5
4
N.C.  
A
VCC  
1
2
3
5
4
N.C.  
A
VCC  
1
N.C.  
A
5
VCC  
GND  
Y
2
3
GND  
Y
4
GND  
Y
DRY PACKAGE  
(TOP VIEW)  
1
2
3
6
5
4
N.C.  
A
VCC  
N.C.  
Y
GND  
N.C. – No internal connection  
See mechanical drawings for dimensions.  
YZP PACKAGE  
(TOP VIEW)  
YZP PACKAGE TERMINAL ASSIGNMENTS  
1
2
VCC  
No ball  
Y
A1  
B1  
C1  
A2  
B2  
C2  
DNU  
A
VCC  
A
B
C
DNU  
A
GND  
Y
GND  
DNU – Do not use  
YZV PACKAGE  
(TOP VIEW)  
YZV PACKAGE TERMINAL ASSIGNMENTS  
1
A
2
VCC  
Y
A1  
B1  
A2  
B2  
A
VCC  
Y
A
B
GND  
GND  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2000–2008, Texas Instruments Incorporated  

SN74LVC1G07DCKTG4 替代型号

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