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SN74LVC1G0832_07 PDF预览

SN74LVC1G0832_07

更新时间: 2024-11-02 06:12:55
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德州仪器 - TI 输入元件
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17页 624K
描述
SINGLE 3-INPUT POSITIVE AND-OR GATE

SN74LVC1G0832_07 数据手册

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SN74LVC1G0832  
SINGLE 3-INPUT POSITIVE AND-OR GATE  
www.ti.com  
SCES606CSEPTEMBER 2004REVISED JANUARY 2007  
FEATURES  
DBV PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoFree™ Package  
C
1
2
6
5
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5 ns at 3.3 V  
A
VCC  
GND  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
3
4
B
Y
Input Hysteresis Allows Slow Input  
Transition and Better Switching Noise  
Immunity at the Input  
DCK PACKAGE  
(TOP VIEW)  
(Vhys = 250 mV Typ @ 3.3 V)  
Can Be Used in Three Combinations:  
C
1
2
3
6
5
4
A
AND-OR Gate  
AND Gate  
OR Gate  
VCC  
Y
GND  
B
Ioff Supports Partial-Power-Down Mode  
Operation  
YZP PACKAGE  
(BOTTOM VIEW)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
3
2
1
4
5
6
B
GND  
A
Y
ESD Protection Exceeds JESD 22  
VCC  
C
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This device is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G0832 is a single 3-input positive AND-OR gate. It performs the Boolean function Y = (A B ) +  
C in positive logic.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
Reel of 3000 SN74LVC1G0832YZPR  
_ _ _DC_  
CDC_  
0.23-mm Large Bump – YZP (Pb-free)  
SOT (SOT-23) – DBV  
Reel of 3000 SN74LVC1G0832DBVR  
Reel of 250 SN74LVC1G0832DBVT  
Reel of 3000 SN74LVC1G0832DCKR  
Reel of 250 SN74LVC1G0832DCKT  
–40°C to 85°C  
SOT (SC-70) – DCK  
DC_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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