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SN74LVC1G08DCK PDF预览

SN74LVC1G08DCK

更新时间: 2024-11-01 23:11:03
品牌 Logo 应用领域
德州仪器 - TI 栅极逻辑集成电路光电二极管输入元件
页数 文件大小 规格书
16页 434K
描述
SINGLE 2-INPUT POSITIVE-AND GATE

SN74LVC1G08DCK 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOIC包装说明:PLASTIC, SO-5
针数:5Reach Compliance Code:unknown
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:5.21Is Samacsys:N
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G5
长度:2 mm逻辑集成电路类型:AND GATE
功能数量:1输入次数:2
端子数量:5最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP5/6,.08
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):NOT SPECIFIED传播延迟(tpd):8 ns
认证状态:Not Qualified座面最大高度:1.1 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1.25 mmBase Number Matches:1

SN74LVC1G08DCK 数据手册

 浏览型号SN74LVC1G08DCK的Datasheet PDF文件第2页浏览型号SN74LVC1G08DCK的Datasheet PDF文件第3页浏览型号SN74LVC1G08DCK的Datasheet PDF文件第4页浏览型号SN74LVC1G08DCK的Datasheet PDF文件第5页浏览型号SN74LVC1G08DCK的Datasheet PDF文件第6页浏览型号SN74LVC1G08DCK的Datasheet PDF文件第7页 
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢊ  
ꢋ ꢁꢈ ꢄ ꢌ ꢍ ꢎꢋꢁ ꢏꢐꢑ ꢏꢒ ꢀꢋ ꢑ ꢋꢅꢌ ꢎꢓ ꢁꢔ ꢈ ꢓꢑꢌ  
SCES217S − APRIL 1999 − REVISED JUNE 2005  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
I
Supports Partial-Power-Down Mode  
off  
Operation  
D
D
D
D
D
Supports 5-V V  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
CC  
Inputs Accept Voltages to 5.5 V  
Max t of 3.6 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
24-mA Output Drive at 3.3 V  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
CC  
− 1000-V Charged-Device Model (C101)  
YEA, YEP, YZA,  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
OR YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
5
Y
GND  
B
1
2
3
5
A
V
Y
A
B
V
1
2
3
5
CC  
CC  
1
2
3
5
A
B
V
Y
CC  
B
V
A
CC  
4
GND  
Y
4
GND  
4
GND  
See mechanical drawings for dimensions.  
description/ordering information  
Y + A B or Y + A ) B  
The SN74LVC1G08 performs the Boolean function  
in positive logic.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,  
off  
off  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC1G08YEAR  
NanoFree− WCSP (DSBGA)  
SN74LVC1G08YZAR  
SN74LVC1G08YEPR  
SN74LVC1G08YZPR  
0.17-mm Small Bump − YZA (Pb-free)  
Reel of 3000  
_ _ _CE_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
SN74LVC1G08DBVR  
SN74LVC1G08DBVT  
SN74LVC1G08DCKR  
SN74LVC1G08DCKT  
SOT (SOT-23) − DBV  
C08_  
CE_  
SOT (SC-70) − DCK  
SOT (SOT-553) − DRL  
Reel of 4000  
SN74LVC1G08DRLR  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢑꢡ  
Copyright 2005, Texas Instruments Incorporated  
ꢝ ꢡ ꢞ ꢝꢖ ꢗꢫ ꢙꢘ ꢜ ꢤꢤ ꢢꢜ ꢚ ꢜ ꢛ ꢡ ꢝ ꢡ ꢚ ꢞ ꢦ  
ꢜꢚ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

SN74LVC1G08DCK 替代型号

型号 品牌 替代类型 描述 数据表
935268380165 NXP

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935268380125 NXP

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