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SN74LVC1G07-EP PDF预览

SN74LVC1G07-EP

更新时间: 2024-11-02 12:15:03
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
12页 543K
描述
SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

SN74LVC1G07-EP 数据手册

 浏览型号SN74LVC1G07-EP的Datasheet PDF文件第2页浏览型号SN74LVC1G07-EP的Datasheet PDF文件第3页浏览型号SN74LVC1G07-EP的Datasheet PDF文件第4页浏览型号SN74LVC1G07-EP的Datasheet PDF文件第5页浏览型号SN74LVC1G07-EP的Datasheet PDF文件第6页浏览型号SN74LVC1G07-EP的Datasheet PDF文件第7页 
SN74LVC1G07-EP  
SINGLE BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES685JULY 2007  
FEATURES  
Controlled Baseline  
Low Power Consumption, 10-μA Max ICC  
±24-mA Output Drive at 3.3 V  
One Assembly/Test Site, One Fabrication  
Site  
Ioff Supports Partial-Power-Down Mode  
Operation  
Extended Temperature Performance of –55°C  
to 125°C  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
ESD Protection Exceeds JESD 22  
Enhanced Product-Change Notification  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
(1)  
Qualification Pedigree  
Supports 5-V VCC Operation  
1000-V Charged-Device Model (C101)  
Input and Open-Drain Output Accept  
Voltages up to 5.5 V  
Max tpd of 5.7 ns at 3.3 V  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
DCK PACKAGE  
(TOP VIEW)  
NC  
A
V
1
2
3
5
CC  
4
GND  
Y
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single buffer/driver is designed for 1.65-V to 5.5-V VCC operation.  
The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to  
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.  
This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION(1)  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
TA  
PACKAGE(2)  
SOT (SC-70) – DCK  
–55°C to 125°C  
Reel of 3000  
SN74LVC1G07MDCKREP  
CVK  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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