SN74LVC1G07-EP
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
www.ti.com
SCES685–JULY 2007
FEATURES
•
Controlled Baseline
•
•
•
Low Power Consumption, 10-μA Max ICC
±24-mA Output Drive at 3.3 V
–
One Assembly/Test Site, One Fabrication
Site
Ioff Supports Partial-Power-Down Mode
Operation
•
•
Extended Temperature Performance of –55°C
to 125°C
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Enhanced Diminishing Manufacturing Sources
(DMS) Support
ESD Protection Exceeds JESD 22
•
•
•
•
Enhanced Product-Change Notification
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
(1)
Qualification Pedigree
Supports 5-V VCC Operation
1000-V Charged-Device Model (C101)
Input and Open-Drain Output Accept
Voltages up to 5.5 V
•
Max tpd of 5.7 ns at 3.3 V
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DCK PACKAGE
(TOP VIEW)
NC
A
V
1
2
3
5
CC
4
GND
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
TA
PACKAGE(2)
SOT (SC-70) – DCK
–55°C to 125°C
Reel of 3000
SN74LVC1G07MDCKREP
CVK
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.