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SN74LVC1G0832 PDF预览

SN74LVC1G0832

更新时间: 2024-11-20 05:29:35
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德州仪器 - TI 输入元件
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13页 281K
描述
SINGLE 3-INPUT POSITIVE AND-OR GATE

SN74LVC1G0832 数据手册

 浏览型号SN74LVC1G0832的Datasheet PDF文件第2页浏览型号SN74LVC1G0832的Datasheet PDF文件第3页浏览型号SN74LVC1G0832的Datasheet PDF文件第4页浏览型号SN74LVC1G0832的Datasheet PDF文件第5页浏览型号SN74LVC1G0832的Datasheet PDF文件第6页浏览型号SN74LVC1G0832的Datasheet PDF文件第7页 
ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢊ ꢋꢌ  
ꢀꢍ ꢁꢈ ꢄ ꢎ ꢋ ꢏꢍꢁ ꢐꢑꢒ ꢐꢓ ꢀꢍ ꢒ ꢍꢅꢎ ꢔꢁꢕꢏ ꢓ ꢖ ꢈ ꢔꢒꢎ  
SCES606 − SEPTEMBER 2004  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
Supports 5-V V  
Operation  
CC  
6
5
4
1
2
3
A
GND  
B
C
Inputs Accept Voltages to 5.5 V  
V
Y
CC  
Max t of 5 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
24-mA Output Drive at 3.3 V  
Input Hysteresis Allows Slow Input  
Transition and Better Switching Noise  
Immunity at the Input  
3 4  
2 5  
1 6  
B
GND  
A
Y
V
CC  
(V  
= 250 mV Typ @ 3.3 V)  
hys  
C
D
Can Be Used in Three Combinations:  
− AND-OR Gate  
− AND Gate  
− OR Gate  
D
D
D
I
Supports Partial-Power-Down Mode  
off  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This device is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G0832 is a single 3-input positive AND-OR gate. It performs the Boolean function  
Y + (A B ) ) C in positive logic.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
SN74LVC1G0832YEPR  
SN74LVC1G0832YZPR  
Reel of 3000  
_ _ _ _  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G0832DBVR  
SN74LVC1G0832DBVT  
SN74LVC1G0832DCKR  
SOT (SOT-23) − DBV  
CDC_  
DC_  
SOT (SC-70) − DCK  
Reel of 250  
SN74LVC1G0832DCKT  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢒꢢ  
Copyright 2004, Texas Instruments Incorporated  
ꢞ ꢢ ꢟ ꢞꢗ ꢘꢬ ꢚꢙ ꢝ ꢥꢥ ꢣꢝ ꢛ ꢝ ꢜ ꢢ ꢞ ꢢ ꢛ ꢟ ꢧ  
ꢟꢗ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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