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SN74AUC1G19 PDF预览

SN74AUC1G19

更新时间： 2024-11-01 23:03:11
品牌 Logo 应用领域
德州仪器 - TI 解码器解复用器
页数 文件大小 规格书
12页 334K
描述
1-OF-2 DECODER/DEMULTIPLEXER

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中文翻译

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SN74AUC1G19 数据手册

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SCES626B – MARCH 2005 – JUNE 2005  
D
D
Available in the Texas Instruments  
D
D
D
D
Max t of 3 ns at 1.8 V V  
pd CC  
Low Power Consumption, 10-µA Max I  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
NanoStart and NanoFreet Package  
CC  
Optimized for 1.8-V Operation and is 3.6-V  
I/O Tolerant to Support Mixed-Mode Signal  
Operation  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
D
I
Supports Partial-Power-Down Mode  
off  
Operation  
D
Sub-1-V Operable  
8-mA Output Drive at 1.8 V V  
− 1000-V Charged-Device Model (C101)  
D
CC  
YEA, YEP, YZA,  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
DBV PACKAGE  
(TOP VIEW)  
OR YZP PACKAGE  
(BOTTOM VIEW)  
3
4
Y
V
E
GND  
A
1
2
3
6
5
4
A
Y
A
GND  
E
Y
V
Y
1
2
3
6
5
4
1
0
0
1
2
3
6
A
Y
V
Y
0
2 5  
CC  
CC  
1
GND  
E
V
Y
CC  
1
1
6
Y
0
GND  
5
4
CC  
E
1
See mechanical drawings for dimensions.  
description/ordering information  
This 1-of-2 decoder/demultiplexer is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.65-V  
CC  
to 1.95-V V  
operation.  
CC  
The SN74AUC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it  
to the outputs Y (true) and Y (complement) when the enable (E) input signal is low.  
0
1
NanoStart and NanoFreet package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
SN74AUC1G19YEPR  
SN74AUC1G19YZPR  
Reel of 3000  
U5_  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74AUC1G19DBVR  
SN74AUC1G19DBVT  
SN74AUC1G19DCKR  
U19_  
U19_  
−40°C to 85°C  
SOT (SOT-23) − DBV  
SOT (SC-70) − DCK  
U5_  
U5_  
Reel of 250  
SN74AUC1G19DCKT  
SN74AUC1G19DRLR  
SOT (SOT-553) − DRL  
Reel of 4000  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
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Copyright 2005, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...12

中文翻译

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