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SKM600GAR126DT PDF预览

SKM600GAR126DT

更新时间: 2024-11-21 19:53:19
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON 局域网功率控制晶体管
页数 文件大小 规格书
4页 430K
描述
Insulated Gate Bipolar Transistor, 600A I(C), 1200V V(BR)CES, N-Channel, CASE D58, 7 PIN

SKM600GAR126DT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:DO-204
包装说明:FLANGE MOUNT, R-XUFM-X7针数:2
Reach Compliance Code:compliant风险等级:5.84
外壳连接:ISOLATED最大集电极电流 (IC):600 A
集电极-发射极最大电压:1200 V配置:SINGLE WITH BUILT-IN DIODE AND THERMISTOR
JESD-30 代码:R-XUFM-X7JESD-609代码:e2
元件数量:1端子数量:7
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:NO
端子面层:Tin/Silver (Sn/Ag)端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):970 ns标称接通时间 (ton):285 ns
Base Number Matches:1

SKM600GAR126DT 数据手册

 浏览型号SKM600GAR126DT的Datasheet PDF文件第2页浏览型号SKM600GAR126DT的Datasheet PDF文件第3页浏览型号SKM600GAR126DT的Datasheet PDF文件第4页 
SKM 600 GAL 126 DT ...  
Absolute Maximum Ratings Tcase = 25 °C, unless otherwise specified  
SEMITRANSTM  
M
Trench IGBT Module  
Symbol Conditions  
Values  
Units  
IGBT  
VCES  
1200  
600 (430)  
1200 (860)  
± 20  
V
A
SKM 600 GAL 126 DT  
SKM 600 GAR 126 DT  
Preliminary Data  
IC  
Tcase = 25 (80) °C  
ICM  
T
case = 25 (80) °C, tp =1 ms  
A
VGES  
Tj, (Tstg  
Visol  
V
)
TOPERATION Tstg  
– 40 ... +150 (125)  
2500  
°C  
V
AC, 1 min.  
Inverse Diode  
IF = –IC  
Tcase = 25 (80) °C  
150 (100)  
400 (300)  
1450  
A
A
A
IFM = –ICM Tcase = 25 (80) °C, tp < 1 ms  
IFSM  
tp = 10 ms; sin.; Tj = 150 °C  
Freewheeling Diode  
IF = –IC  
Tcase = 25 (80) °C  
460 (320)  
1200 (860)  
2900  
A
A
A
IFM = –ICM Tcase = 25 (80) °C, tp < 1 ms  
IFSM  
tp = 10 ms; sin.; Tj = 150 °C  
6(0,75$16ꢀꢁ  
Characteristics  
Symbol Conditions  
IGBT  
Tcase = 25 °C, unless otherwise specified  
min.  
typ.  
max. Units  
VGE(th)  
VGE = VCE, IC = 12 mA  
5,0  
5,8  
6,5  
V
mA  
V
ICES  
V
GE = 0, VCE = VCES, Tj = 25 (125) °C  
0,05(3)  
5 (15)  
*$/  
Features  
*$5  
VCEO  
rCE  
VGE = 15 V, Tj = 25 (125) °C  
VGE = 15 V, Tj = 25 (125) °C  
IC = 400 A, VGE = 15 V,  
0,97(0,88)  
2,1 (3,4)  
1,8 (2,2)  
(4,2)  
mΩ  
V
VCEsat  
Tj = 25 (125) °C chip level  
NPT-IGBT with positive  
temperature coefficient of VCEsat  
Short circuit, self limiting to 6 x IC  
Corresponds to standards  
IEC 60721-3-3 (humidity) class  
3KH/IE32 and IEC 68T.1  
Cies  
Coes  
Cres  
LCE  
29  
2
nF  
nF  
VGE = 0, VCE = 25 V, f = 1 MHz  
1,9  
nF  
20  
nH  
mΩ  
RCC´+ EE´ resistance, terminal-chip 25 (125) °C  
0,4(0,6)  
td(on)  
tr  
td(off)  
VCC = 600 V  
210  
ns  
(climate) 40/125/56  
IC = 400 A  
75  
ns  
RGon = RGoff = 5 Ω  
Tj = 125 °C  
850  
120  
55  
ns  
Typical Applications  
tf  
ns  
Wind generators  
Inverter drives  
UPS  
Eon  
VGE ± 15 V  
mJ  
mJ  
Eoff  
60  
Inverse Diode  
VF = VEC IF = 150 A; VGE = 0 V; Tj = 25 (125) °C  
2,2 (1,95)  
– (1,3)  
– (9)  
2,7  
1,5  
V
V
VTO  
rT  
Tj = 25 (125) °C  
Tj = 25 (125) °C  
(13)  
mΩ  
A
IDC 500 A for TTerminal = 100 °C  
IRRM  
Qrr  
Err  
IF = 150 A; Tj = 125 °C  
55  
V
GE = 0 V  
19  
µC  
mJ  
RGon = RGoff = 5 Ω  
Freewheeling Diode of GAL/GAR type  
VF = VEC IF = 400 A; VGE = 0 V; Tj = 25 (125) °C  
1,8 (1,9)  
1,14(0,95)  
– (1,7)  
390  
2,2  
1,2  
V
V
VTO  
rT  
Tj = 25 (125) °C  
Tj = 25 (125) °C  
(4,0)  
mΩ  
A
IRRM  
Qrr  
Err  
IF = 400 A; Tj = 125 °C  
VGE = 0 V  
85  
µC  
mJ  
RGon = RGoff = 5 Ω  
32  
Thermal Characteristics  
Rthjc  
Rthjc  
Rthjc  
Rthch  
per IGBT  
0,065 K/W  
0,125 K/W  
per FWD  
per Inverse Diode  
per module  
0,25  
K/W  
0,038 K/W  
to heatsink (M6)  
3
5
5
Nm  
Nm  
g
2,5  
325  
© by SEMIKRON  
011022  
1

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