SiZ260DT
Vishay Siliconix
www.vishay.com
Dual N-Channel 80 V (D-S) MOSFETs
FEATURES
• TrenchFET® Gen IV power MOSFETs
PowerPAIR® 3 x 3S
G2
8
S2
7
S2
6
S2
5
• 100 % Rg and UIS tested
• Integrated MOSFET half bridge power stage
D1
• Optimized Qgs/Qgs ratio improves switching
characteristics
1
G1
2
D1
3
D1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
1
Top View
4
D1
Bottom View
D
1
APPLICATIONS
• POL
PRODUCT SUMMARY
CHANNEL-1 CHANNEL-2
G
1
VDS (V)
80
80
• Synchronous buck converter
• Telecom DC/DC
• Resonant converters
• Motor drive control
N-Channel 1
MOSFET
R
DS(on) max. () at VGS = 10 V
DS(on) max. () at VGS = 4.5 V
0.0245
0.0310
6.2
0.0247
0.0310
6.3
S /D
1
2
R
Qg typ. (nC)
D (A) a
G
2
I
24.7
24.6
N-Channel 2
MOSFET
Configuration
Dual
S
2
ORDERING INFORMATION
Package
PowerPAIR 3 x 3S
SiZ260DT-T1-GE3
Lead (Pb)-free and halogen-free
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
CHANNEL-1
CHANNEL-2
80
20
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
80
20
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
24.7 a
19.8
8.9 b, c
7.2 b, c
60
24.6 a
19.7
8.9 b, c
7.1 b, c
60
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (100 μs pulse width)
Continuous source drain diode current
IDM
IS
TC = 25 °C
TA = 25 °C
27
3.6 b, c
27
3.6 b, c
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
12
7.2
33
21
4.3 b, c
2.8 b, c
12
7.2
33
21
4.3 b, c
2.8 b, c
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Maximum power dissipation
PD
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
CHANNEL-1
CHANNEL-2
PARAMETER
SYMBOL
UNIT
TYP.
23
MAX.
29
TYP.
23
MAX.
29
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
t 10 s
Steady state
RthJA
RthJC
°C/W
3
3.8
3
3.8
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR 3 x 3S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 64 °C/W for channel-1 and 64 °C/W for channel-2
S20-0062-Rev. C, 10-Feb-2020
Document Number: 77236
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000