Datasheet > SIS330DN

SIS330DN

更新时间： 2024-11-25 09:25:03

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描述
N-Channel 30 V (D-S) MOSFET

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SIS330DN 数据手册

New Product

SiS330DN

Vishay Siliconix

N-Channel 30 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

•

Halogen-free According to IEC 61249-2-21

I_D(A)^f

35^g

V_DS(V)

R_DS(on)()

Q_g(Typ.)

Definition

0.0056 at V_GS= 10 V

0.0075 at V_GS= 4.5 V

•

TrenchFET^®Power MOSFET

PWM Optimized

100 % R_gTested

100 % UIS Tested

11.2 nC

PowerPAK 1212-8

Compliant to RoHS Directive 2002/95/EC

APPLICATIONS

3.30 mm

•

Notebook

Server

High-Side Switch

- Synchronous Buck Converter

Bottom View

Ordering Information: SiS330DN-T1-GE3 (Lead (Pb)-free and Halogen-free)

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)

Parameter

Symbol

Limit

Unit

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

35^g

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

35^g

Continuous Drain Current (T_J= 150 °C)

I_D

19.1^{a, b}

17.5^{a, b}

Pulsed Drain Current

I_DM

I_S

35^g

3.3^{a, b}

_C= 25 °C

Continuous Source-Drain Diode Current

T_A= 25 °C

L = 0.1 mH

T_C= 25 °C

I_AS

E_AS

Single Pulse Avalanche Current

Single Pulse Avalanche Energy

_C= 70 °C

_A= 25 °C

Maximum Power Dissipation

P_D

3.7^{a, b}

3.1^{a, b}

- 55 to 150

260

T_A= 70 °C

T_J, T_stg

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{c, d}

°C

THERMAL RESISTANCE RATINGS

Parameter

Symbol

R_thJA

R_thJC

Typical

Maximum

Unit

Maximum Junction-to-Ambient^{a, e}

Maximum Junction-to-Case (Drain)

t  10 s

Steady State

°C/W

1.9

2.4

Notes:

a. Surface mounted on 1" x 1" FR4 board.

b. t = 10 s.

c. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and

is not required to ensure adequate bottom side solder interconnection.

d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

e. Maximum under steady state conditions is 81 °C/W.

f. Based on T_C= 25 °C.

g. Package limited.

Document Number: 67079

S10-2605-Rev. A, 15-Nov-10

www.vishay.com

12 3 4 5 6 7...13

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