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SIS334DN PDF预览

SIS334DN

更新时间: 2024-10-14 09:25:03
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 120K
描述
N-Channel 30 V (D-S) MOSFET

SIS334DN 数据手册

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SiS334DN  
Vishay Siliconix  
N-Channel 30 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) () Max.  
0.0113 at VGS = 10 V  
0.0146 at VGS = 4.5 V  
ID (A)a  
20  
Qg (Typ.)  
Definition  
TrenchFET® Power MOSFET  
100 % Rg and UIS Tested  
30  
5.1 nC  
20  
Compliant to RoHS Directive 2002/95/EC  
®
PowerPAK 1212-8  
APPLICATIONS  
Notebook/POL  
- Synchronous Buck  
- High Side  
S
3.30 mm  
3.30 mm  
1
S
2
S
3
G
4
D
D
8
D
7
D
6
D
5
G
Bottom View  
Ordering Information:  
SiS334DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
S
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
20  
20a  
20a  
13.6b, c  
10.8b, c  
50  
T
T
C = 25 °C  
C = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed Drain Current (t = 300 µs)  
Avalanche Current  
IDM  
IAS  
15  
L = 0.1 mH  
Avalanche Energy  
EAS  
mJ  
A
11.25  
20a  
3.4b, c  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
Maximum Power Dissipation  
IS  
TA = 25 °C  
T
T
C = 25 °C  
C = 70 °C  
50  
32  
PD  
W
3.8b, c  
2.4b, c  
- 55 to 150  
260  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
Maximum Junction-to-Ambientb, f  
RthJA  
RthJC  
t 10 s  
Steady State  
27  
2
33  
°C/W  
Maximum Junction-to-Case (Drain)  
2.5  
Notes:  
a. Package limited.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 81 °C/W.  
Document Number: 63371  
S11-1659-Rev. A, 15-Aug-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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