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SiS415DNT PDF预览

SiS415DNT

更新时间: 2024-10-15 14:53:23
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威世 - VISHAY /
页数 文件大小 规格书
9页 230K
描述
P-Channel 20 V (D-S) MOSFET

SiS415DNT 数据手册

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SiS415DNT  
Vishay Siliconix  
www.vishay.com  
P-Channel 20 V (D-S) MOSFET  
FEATURES  
• TrenchFET® Gen III P-channel power MOSFET  
PowerPAK® 1212-8S  
D
8
D
7
D
6
• Thin 0.8 mm maximum height  
D
5
• 100 % Rg and UIS tested  
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
1
S
2
S
3
S
4
G
APPLICATIONS  
1
S
• Smart phones, tablet PCs, and  
Top View  
Bottom View  
mobile computing  
- Battery switch  
- Load switch  
- Power management  
PRODUCT SUMMARY  
VDS (V)  
G
-20  
R
R
DS(on) max. () at VGS = -10 V  
DS(on) max. () at VGS = -4.5 V  
0.0040  
0.0055  
0.0095  
55.5  
RDS(on) max. () at VGS = -2.5 V  
Qg typ. (nC)  
D
ID (A)  
-35 a  
P-Channel MOSFET  
Configuration  
Single  
ORDERING INFORMATION  
Package  
Lead (Pb)-free and halogen-free  
PowerPAK 1212-8S  
SiS415DNT-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-source voltage  
Gate-source voltage  
SYMBOL  
LIMIT  
-20  
12  
UNIT  
VDS  
VGS  
V
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
-35 a  
-35 a  
-22.6 b, c  
-18.2 b, c  
-80  
-35 a  
-3.3 b, c  
-20  
Continuous drain current (TJ = 150 °C)  
ID  
A
Pulsed drain current (t = 300 μs)  
IDM  
IS  
TC = 25 °C  
Continuous source-drain diode current  
TA = 25 °C  
Avalanche current  
Single pulse avalanche energy  
IAS  
EAS  
L = 0.1 mH  
20  
mJ  
T
T
C = 25 °C  
C = 70 °C  
52  
33  
Maximum power dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
3.7 b, c  
2.4 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b, f  
Maximum junction-to-case (drain)  
SYMBOL  
RthJA  
RthJC  
TYPICAL  
MAXIMUM  
UNIT  
t 10 s  
Steady state  
26  
1.9  
33  
2.4  
°C/W  
Notes  
a. Package limited  
b. Surface mounted on 1" x 1" FR4 board  
c. t = 10 s  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components  
f. Maximum under steady state conditions is 81 °C/W  
S17-1449-Rev. B, 18-Sep-17  
Document Number: 63684  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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