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SIS402DN_09 PDF预览

SIS402DN_09

更新时间: 2024-10-14 09:25:03
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 563K
描述
N-Channel 30-V (D-S) MOSFET

SIS402DN_09 数据手册

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SiS402DN  
Vishay Siliconix  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)a, g Qg (Typ.)  
Definition  
0.006 at VGS = 10 V  
0.008 at VGS = 4.5 V  
35  
TrenchFET® Power MOSFET  
100 % Rg Tested  
100 % UIS Tested  
30  
12 nC  
35  
Compliant to RoHS Directive 2002/95/EC  
®
PowerPAK 1212-8  
APPLICATIONS  
DC/DC Converter  
- Notebook  
- POL  
S
3.30 mm  
3.30 mm  
D
1
S
2
S
3
G
4
D
8
D
G
7
D
6
D
5
S
Bottom View  
N-Channel MOSFET  
Ordering Information:  
SiS402DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
VGS  
Limit  
30  
20  
Unit  
V
35a, g  
35g  
19b, c  
15b, c  
70  
35  
61  
43  
3.2b, c  
52  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
Pulsed Drain Current  
Avalanche Current  
Avalanche Energy  
IDM  
IAS  
EAS  
L = 0.1 mH  
mJ  
A
T
T
C = 25 °C  
A = 25 °C  
Continuous Source-Drain Diode Current  
IS  
TC = 25 °C  
C = 70 °C  
T
33  
Maximum Power Dissipation  
PD  
W
3.8b, c  
2b, c  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
RthJC  
Typical  
24  
Maximum  
Unit  
t 10 s  
Steady State  
33  
°C/W  
1.9  
2.4  
Notes:  
a. Based on TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK 1212 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 81 °C/W.  
g. Package limited.  
Document Number: 68684  
S09-1086-Rev. C, 15-Jun-09  
www.vishay.com  
1

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