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SIS332DN-T1-GE3 PDF预览

SIS332DN-T1-GE3

更新时间: 2024-11-21 09:25:03
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
13页 578K
描述
N-Channel 30 V (D-S) MOSFET

SIS332DN-T1-GE3 技术参数

生命周期:Obsolete包装说明:SMALL OUTLINE, S-PDSO-C5
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.84
Is Samacsys:N雪崩能效等级(Eas):20 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):35 A
最大漏极电流 (ID):35 A最大漏源导通电阻:0.0084 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-PDSO-C5
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):33 W
最大脉冲漏极电流 (IDM):50 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIS332DN-T1-GE3 数据手册

 浏览型号SIS332DN-T1-GE3的Datasheet PDF文件第2页浏览型号SIS332DN-T1-GE3的Datasheet PDF文件第3页浏览型号SIS332DN-T1-GE3的Datasheet PDF文件第4页浏览型号SIS332DN-T1-GE3的Datasheet PDF文件第5页浏览型号SIS332DN-T1-GE3的Datasheet PDF文件第6页浏览型号SIS332DN-T1-GE3的Datasheet PDF文件第7页 
New Product  
SiS332DN  
Vishay Siliconix  
N-Channel 30 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
ID (A)f  
35g  
35g  
VDS (V)  
RDS(on) ()  
Qg (Typ.)  
Definition  
0.0084 at VGS = 10 V  
0.0110 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
PWM Optimized  
100 % Rg Tested  
100 % UIS Tested  
30  
8.1 nC  
PowerPAK 1212-8  
Compliant to RoHS Directive 2002/95/EC  
APPLICATIONS  
S
D
3.30 mm  
3.30 mm  
High Side Switch  
- POL  
1
S
2
S
3
G
4
- Notebook PC  
- Server  
D
8
D
G
7
D
6
D
5
Bottom View  
Ordering Information: SiS332DN-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
30  
20  
V
35g  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
35g  
Continuous Drain Current (TJ = 150 °C)  
ID  
15.4a, b  
12.3a, b  
50  
A
Pulsed Drain Current (t = 300 µs)  
IDM  
IS  
35g  
3.2a, b  
20  
20  
33  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
IAS  
EAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
mJ  
W
T
T
C = 70 °C  
A = 25 °C  
21  
Maximum Power Dissipation  
PD  
3.6a, b  
2.3a, b  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJC  
Typical  
28  
Maximum  
Unit  
Maximum Junction-to-Ambienta, e  
Maximum Junction-to-Case (Drain)  
t 10 s  
Steady State  
35  
°C/W  
2.9  
3.8  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. t = 10 s.  
c. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
e. Maximum under steady state conditions is 81 °C/W.  
f. Based on TC = 25 °C.  
g. Package limited.  
Document Number: 67848  
S11-0859-Rev. A, 02-May-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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