Datasheet > SIR484DP

SIR484DP

更新时间： 2024-09-28 06:11:47

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
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描述
N-Channel 20-V (D-S) MOSFET

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SIR484DP 数据手册

SiR484DP

Vishay Siliconix

N-Channel 20-V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

•

Halogen-free

V_DS(V)

R_DS(on)(Ω)

Q_g(Typ.)

_D(A)^{a, g}

• TrenchFET^®Power MOSFET

0.0083 at V_GS= 10 V

0.0115 at V_GS= 4.5 V

•

Low Thermal Resistance PowerPAK^®

7.1 nC

Package with Low 1.07 mm Profile

Optimized for High-Side Synchronous Rectifier

Operation

PowerPAK SO-8

•

100 % R_gTested

100 % UIS Tested

6.15 mm

5.15 mm

APPLICATIONS

•

Notebook CPU Core

- High-Side Switch

•

POL

Bottom View

Ordering Information: SiR484DP-T1-GE3 (Lead (Pb)-free and Halogen-free)

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted

Parameter

Drain-Source Voltage

Gate-Source Voltage

Symbol

V_DS

V_GS

Limit

Unit

20^g

T_C= 25 °C

_C= 70 °C

20^g

Continuous Drain Current (T_J= 150 °C)

I_D

17.2^{b, c}

13.7^{b, c}

20^g

3.2^{b, c}

T_A= 25 °C

T_A= 70 °C

I_DM

I_S

Pulsed Drain Current

T_C= 25 °C

Continuous Source-Drain Diode Current

T_A= 25 °C

Single Pulse Avalanche Current

Avalanche Energy

I_AS

L = 0.1 mH

E_AS

_C= 25 °C

_C= 70 °C

29.8

19.0

3.9^{b, c}

2.5^{b, c}

P_D

Maximum Power Dissipation

T_A= 25 °C

T_A= 70 °C

T_J, T_stg

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Maximum Junction-to-Case (Drain)

Symbol

R_thJA

R_thJC

Typical

Maximum

Unit

t ≤ 10 s

Steady State

°C/W

3.5

4.2

Notes:

a. Base on T_C= 25 °C.

b. Surface Mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and

is not required to ensure adequate bottom side solder interconnection.

e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under Steady State conditions is 70 °C/W.

g. Package Limited.

Document Number: 69024

S-82664-Rev. A, 03-Nov-08

www.vishay.com

12 3 4 5 6 7

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