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SIR496DP PDF预览

SIR496DP

更新时间: 2024-01-11 04:24:10
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 483K
描述
N-Channel 20 V (D-S) MOSFET

SIR496DP 数据手册

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SiR496DP  
Vishay Siliconix  
N-Channel 20 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a, g  
Definition  
35g  
35g  
0.0045 at VGS = 10 V  
0.0058 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
100 % Rg Tested  
20  
13.2 nC  
100 % Avalanche Tested  
PowerPAK® SO-8  
Compliant to RoHS Directive 2002/95/EC  
APPLICATIONS  
S
High Current DC/DC  
- Low-Side Switch  
POL  
6.15 mm  
5.15 mm  
D
1
S
2
S
3
G
4
D
8
D
G
7
D
6
D
5
Bottom View  
S
Ordering Information: SiR496DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
20  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
A
VGS  
20  
35g  
35g  
25.7b, c  
20.5b, c  
70  
35g  
4.5b, c  
20  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
IDM  
IS  
Pulsed Drain Current  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
EAS  
mJ  
W
20  
27.7  
17.7  
5.0b, c  
3.2b, c  
T
C = 70 °C  
PD  
Maximum Power Dissipation  
TA = 25 °C  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
Maximum  
Unit  
t 10 s  
Steady State  
20  
25  
°C/W  
RthJC  
3.4  
4.5  
Notes:  
a. Based on TC = 25 °C.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 70 °C/W.  
g. Package limited.  
Document Number: 68859  
S10-2004-Rev. B, 06-Sep-10  
www.vishay.com  
1

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