Datasheet > SiR500DP

SiR500DP

更新时间： 2024-10-01 14:54:27

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	234K
描述
N-Channel 30 V (D-S) 150 °C MOSFET

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SiR500DP 数据手册

SiR500DP

Vishay Siliconix

www.vishay.com

N-Channel 30 V (D-S) 150 °C MOSFET

FEATURES

• TrenchFET^®Gen V power MOSFET

PowerPAK^®SO-8 Single

• Very low R_DSx Q_gfigure-of-merit (FOM)

• Enables higher power density with very low

R_DS(on)and thermally enhanced compact

package

• 100 % R_gand UIS tested

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

Top View

Bottom View

• DC/DC converter

• POL

PRODUCT SUMMARY

V_DS(V)

• Synchronous rectification

R_DS(on)max. (Ω) at V_GS= 10 V

R_DS(on)max. (Ω) at V_GS= 4.5 V

Q_gtyp. (nC)

0.00047

0.00068

54.3

• Battery management

• Power and load switch

I_D(A) ^a

350.8

N-Channel MOSFET

Configuration

Single

ORDERING INFORMATION

Package

PowerPAK SO-8

Lead (Pb)-free and halogen-free

SIR500DP-T1-RE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-source voltage

Gate-source voltage

SYMBOL

LIMIT

UNIT

V_DS

V_GS

+16 / -12

350.8

280.7

85.9 ^b

68.7 ^b

500

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Continuous drain current (T_J= 150 °C)

I_D

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

94.6

5.6 ^{b, c}

Continuous source-drain diode current

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

125

104.1

66.6

6.25 ^b

4 ^b

L = 0.1 mH

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A=70 °C

Maximum power dissipation

P_D

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^c

T_J, T_stg

-55 to +150

260

°C

THERMAL RESISTANCE RATINGS

PARAMETER

SYMBOL

R_thJA

R_thJC

TYPICAL

MAXIMUM

UNIT

Maximum junction-to-ambient ^b

t < 10 s

Steady state

1.2

°C/W

Maximum junction-to-case (drain)

0.9

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 54 °C/W

S20-0968-Rev. A, 21-Dec-2020

Document Number: 66840

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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