SiR5607DP
Vishay Siliconix
www.vishay.com
P-Channel 60 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen V p-channel power MOSFET
PowerPAK® SO-8 Single
D
D
7
8
• Very low RDS(on) minimizes voltage drop and
reduces conduction loss
D
6
D
5
• 100 % Rg and UIS tested
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
1
2
S
S
S
3
APPLICATIONS
4
G
S
1
• Adapter and charger switch
• Battery and circuit protection
Top View
Bottom View
G
• OR-ing
PRODUCT SUMMARY
VDS (V)
-60
• Load switch
RDS(on) max. () at VGS = -10 V
RDS(on) max. () at VGS = -4.5 V
Qg typ. (nC)
0.007
0.012
31.7
-90.9
Single
• Motor drive control
D
ID (A) a
P-Channel MOSFET
Configuration
ORDERING INFORMATION
Package
PowerPAK SO-8
Lead (Pb)-free and halogen-free
Lead (Pb)-free, halogen-free, BLR and IOL
SiR5607DP-T1-RE3
SiR5607DP-T1-UE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-60
+20 / -20
-90.9
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
-72.7
Continuous drain current (TJ = 150 °C)
ID
-22.2 b, c
17.8 b, c
-250
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
-94.6
-5.7 b, c
-50
125
104
66.6
6.25 b, c
4 b, c
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Maximum power dissipation
PD
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
RthJC
TYPICAL
15
MAXIMUM
UNIT
t 10 s
Steady state
20
1.2
°C/W
Maximum junction-to-case (drain)
0.9
Notes
a. TC = 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 54 °C/W
S23-0761-Rev. B, 25-Sep-2023
Document Number: 62247
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000