Datasheet > SiR5623DP

SiR5623DP

更新时间： 2023-12-06 20:08:37

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
7页	202K
描述
P-Channel 60 V (D-S) MOSFET

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SiR5623DP 数据手册

SiR5623DP

Vishay Siliconix

www.vishay.com

P-Channel 60 V (D-S) MOSFET

FEATURES

PowerPAK^®SO-8 Single

• New generation p-channel power MOSFET

• Ultra low R_DSx Q_gFOM product

• 100 % R_gand UIS tested

• Material categorization: for definitions of

compliance

please

see

www.vishay.com/doc?99912

APPLICATIONS

• Battery and circuit protection

• Load switch

Top View

Bottom View

PRODUCT SUMMARY

V_DS(V)

• Motor drive control

-60

R_DS(on)max. () at V_GS= -10 V

R_DS(on)max. () at V_GS= -4.5 V

Q_gtyp. (nC)

0.024

0.046

10.1

-37.1 ^a

P-Channel MOSFET

I_D(A)

Configuration

Single

ORDERING INFORMATION

Package

PowerPAK SO-8

Lead (Pb)-free and halogen-free

SiR5623DP-T1-RE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

Drain-source voltage

Gate-source voltage

SYMBOL

LIMIT

-60

UNIT

V_DS

V_GS

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

-37.1

-29.6

-10.5 ^{b, c}

-8.4 ^{b, c}

-80

-49.6

-4.0 ^{b, c}

-20

Continuous drain current (T_J= 150 °C)

I_D

Pulsed drain current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

Continuous source-drain diode current

T_A= 25 °C

Single pulse avalanche current

Single pulse avalanche energy

I_AS

E_AS

L = 0.1 mH

59.5

_C= 25 °C

_C= 70 °C

38.0

Maximum power dissipation

P_D

T_A= 25 °C

T_A= 70 °C

4.8 ^{b, c}

3.0 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^d

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^b

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  10 s

Steady state

°C/W

Maximum junction-to-case (drain)

R_thJC

1.7

2.1

Notes

a. T_C= 25 °C

b. Surface mounted on 1" x 1" FR4 board

c. t = 10 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 70 °C/W

S23-0036-Rev. A, 30-Jan-2023

Document Number: 62198

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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