SIR5102DP
Vishay Siliconix
www.vishay.com
N-Channel 100 V (D-S) MOSFET
FEATURES
PowerPAK® SO-8 Single
D
• TrenchFET® Gen V power MOSFET
• Ultra-low RDS x Qg FOM product
• Optimized Qgd/Qgs ratio
D
7
8
D
6
D
5
• Excellent efficiency performance in
power supplies
1
S
• 100 % Rg and UIS tested
2
S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
3
4
G
S
1
Top View
Bottom View
APPLICATIONS
D
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = 10 V
• Synchronous rectification
100
0.0041
0.0056
25.1
• Primary side switch
• OR-ing and hot swap switch
G
RDS(on) max. () at VGS = 7.5 V
• Motor drive control
• Battery management
Qg typ. (nC)
ID (A)
110
Configuration
Single
S
N-Channel MOSFET
ORDERING INFORMATION
Package
PowerPAK SO-8
Lead (Pb)-free and halogen-free
SIR5102DP-T1-RE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
100
20
UNIT
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
110
88
27 b, c
21.5 b, c
300
94
5.6 b, c
45
101
104
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
66.6
Maximum power dissipation
PD
6.25 b, c
4 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
RthJA
RthJC
TYPICAL
15
MAXIMUM
UNIT
Maximum junction-to-ambient b
t 10 s
Steady state
20
1.2
°C/W
Maximum junction-to-case (drain)
0.9
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 54 °C/W
g. TC = 25 °C
S21-0333-Rev. A, 05-Apr-2021
Document Number: 63056
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000