IRFR1N60A, IRFU1N60A, SiHFR1N60A, SiHFU1N60A
Power MOSFET
FEATURES
• Low Gate Charge Qg Results in Simple Drive
Requirement
PRODUCT SUMMARY
VDS (V)
600
Available
RDS(on) (Max.) (Ω)
Qg (Max.) (nC)
VGS = 10 V
7.0
RoHS*
• Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
14
2.7
COMPLIANT
Q
Q
gs (nC)
gd (nC)
8.1
• Fully Characterized Capacitance and Avalanche Voltage
and Current
Configuration
Single
• Lead (Pb)-free Available
D
APPLICATIONS
DPAK
IPAK
(TO-252)
(TO-251)
• Switch Mode Power Supply (SMPS)
• Uninterruptible Power Supply
• Power Factor Correction
G
TYPICAL SMPS TOPOLOGIES
S
• Low Power Single Transistor Flyback
N-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
IRFR1N60APbF
SiHFR1N60A-E3
IRFR1N60A
DPAK (TO-252)
IRFR1N60ATRLPbFa
SiHFR1N60ATL-E3a
DPAK (TO-252)
IRFR1N60ATRPbFa
SiHFR1N60AT-E3a
IRFR1N60ATRa
SiHFR1N60ATa
DPAK (TO-252)
IRFR1N60ATRRPbFa IRFU1N60APbF
SiHFR1N60ATR-E3a
IPAK (TO-251)
Lead (Pb)-free
SiHFU1N60A-E3
IRFU1N60A
-
-
-
-
SnPb
SiHFR1N60A
SiHFU1N60A
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
600
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
30
TC = 25 °C
C = 100 °C
1.4
Continuous Drain Current
VGS at 10 V
ID
T
0.89
5.6
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.28
93
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
1.4
EAR
3.6
mJ
W
Maximum Power Dissipation
TC = 25 °C
PD
36
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
3.8
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
300d
°C
for 10 s
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