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SIHFU1N60A-E3 PDF预览

SIHFU1N60A-E3

更新时间: 2024-11-21 06:11:43
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
8页 156K
描述
Power MOSFET

SIHFU1N60A-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TO-251
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:unknown风险等级:5.15
Is Samacsys:N雪崩能效等级(Eas):93 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:600 V最大漏极电流 (Abs) (ID):1.4 A
最大漏极电流 (ID):1.4 A最大漏源导通电阻:7 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-251
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):36 W最大脉冲漏极电流 (IDM):5.6 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIHFU1N60A-E3 数据手册

 浏览型号SIHFU1N60A-E3的Datasheet PDF文件第2页浏览型号SIHFU1N60A-E3的Datasheet PDF文件第3页浏览型号SIHFU1N60A-E3的Datasheet PDF文件第4页浏览型号SIHFU1N60A-E3的Datasheet PDF文件第5页浏览型号SIHFU1N60A-E3的Datasheet PDF文件第6页浏览型号SIHFU1N60A-E3的Datasheet PDF文件第7页 
IRFR1N60A, IRFU1N60A, SiHFR1N60A, SiHFU1N60A  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Low Gate Charge Qg Results in Simple Drive  
Requirement  
PRODUCT SUMMARY  
VDS (V)  
DS(on) (Max.) (Ω)  
Qg (Max.) (nC)  
600  
Available  
R
VGS = 10 V  
7.0  
RoHS*  
• Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
14  
2.7  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
8.1  
• Fully Characterized Capacitance and Avalanche Voltage  
and Current  
Configuration  
Single  
• Lead (Pb)-free Available  
D
APPLICATIONS  
DPAK  
IPAK  
(TO-252)  
(TO-251)  
• Switch Mode Power Supply (SMPS)  
• Uninterruptible Power Supply  
• Power Factor Correction  
G
TYPICAL SMPS TOPOLOGIES  
S
• Low Power Single Transistor Flyback  
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFR1N60APbF  
SiHFR1N60A-E3  
IRFR1N60A  
DPAK (TO-252)  
IRFR1N60ATRLPbFa  
SiHFR1N60ATL-E3a  
DPAK (TO-252)  
IRFR1N60ATRPbFa  
SiHFR1N60AT-E3a  
IRFR1N60ATRa  
SiHFR1N60ATa  
DPAK (TO-252)  
IRFR1N60ATRRPbFa IRFU1N60APbF  
SiHFR1N60ATR-E3a  
IPAK (TO-251)  
Lead (Pb)-free  
SiHFU1N60A-E3  
IRFU1N60A  
-
-
-
-
SnPb  
SiHFR1N60A  
SiHFU1N60A  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
600  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
30  
TC = 25 °C  
C = 100 °C  
1.4  
Continuous Drain Current  
VGS at 10 V  
ID  
T
0.89  
5.6  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.28  
93  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
1.4  
EAR  
3.6  
mJ  
W
Maximum Power Dissipation  
TC = 25 °C  
PD  
36  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
3.8  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
300d  
°C  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 95 mH, RG = 25 Ω, IAS = 1.4 A (see fig. 12).  
c. ISD 1.4 A, dI/dt 180 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91267  
S-81367-Rev. A, 21-Jul-08  
www.vishay.com  
1

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