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SIHFU210-E3 PDF预览

SIHFU210-E3

更新时间: 2024-11-21 12:14:51
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
7页 4915K
描述
Power MOSFET

SIHFU210-E3 数据手册

 浏览型号SIHFU210-E3的Datasheet PDF文件第2页浏览型号SIHFU210-E3的Datasheet PDF文件第3页浏览型号SIHFU210-E3的Datasheet PDF文件第4页浏览型号SIHFU210-E3的Datasheet PDF文件第5页浏览型号SIHFU210-E3的Datasheet PDF文件第6页浏览型号SIHFU210-E3的Datasheet PDF文件第7页 
IRFR210, IRFU210, SiHFR210, SiHFU210  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
200  
Available  
• Repetitive Avalanche Rated  
RDS(on) (Ω)  
VGS = 10 V  
1.5  
RoHS*  
• Surface Mount (IRFR210/SiHFR210)  
• Straight Lead (IRFU210/SiHFU210)  
• Available in Tape and Reel  
• Fast Switching  
Qg (Max.) (nC)  
8.2  
1.8  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
4.5  
Configuration  
Single  
• Ease of Paralleling  
D
• Lead (Pb)-free Available  
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFR210PbF  
SiHFR210-E3  
IRFR210  
DPAK (TO-252)  
DPAK (TO-252)  
IRFR210TRPbFa  
SiHFR210T-E3a  
IRFR210TRa  
DPAK (TO-252)  
IPAK (TO-251)  
IRFU210PbF  
SiHFU210-E3  
IRFU210  
IRFR210TRLPbFa  
SiHFR210TL-E3a  
IRFR210TRLa  
-
Lead (Pb)-free  
-
IRFR210TRRa  
SiHFR210TRa  
SnPb  
SiHFR210  
SiHFR210TLa  
SiHFR210Ta  
SiHFU210  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
200  
20  
V
VGS  
TC = 25 °C  
TC =100°C  
2.6  
Continuous Drain Current  
VGS at 10 V  
ID  
1.7  
A
Pulsed Drain Currenta  
IDM  
10  
Linear Derating Factor  
0.20  
0.020  
130  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Avalanche Currenta  
EAS  
IAR  
mJ  
A
2.7  
Repetitive Avalanche Energya  
EAR  
2.5  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
25  
PD  
W
V/ns  
°C  
TA = 25 °C  
2.5  
dV/dt  
5.0  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
260d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 28 mH, RG = 25 Ω, IAS = 2.6 A (see fig. 12).  
c. ISD 2.6 A, dI/dt 70 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
www.kersemi.com  
1

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