IRFIB7N50L, SiHFIB7N50L
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Super Fast Body Diode Eliminates the Need for
External Diodes in ZVS Applications
500
R
DS(on) (Ω)
VGS = 10 V
0.320
RoHS
• Lower Gate Charge Results in Simpler Drive
Reqirements
COMPLIANT
Qg (Max.) (nC)
92
24
44
Q
Q
gs (nC)
gd (nC)
• Enhanced dV/dt Capabilities Offer Improved
Ruggedness
Configuration
Single
• Higher Gate Voltage Threshold Offers Improved Noise
Immunity
D
TO-220 FULLPAK
• Lead (Pb)-free
APPLICATIONS
G
• Zero Voltage Switching SMPS
• Telecom and Server Power Supplies
• Uninterruptible Power Supplies
• Motor Control Applications
S
N-Channel MOSFET
S
D
G
ORDERING INFORMATION
Package
TO-220 FULLPAK
IRFIB7N50LPbF
SiHFIB7N50L-E3
Lead (Pb)-free
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
500
V
VGS
30
TC = 25 °C
TC =100°C
6.8
Continuous Drain Current
VGS at 10 V
ID
4.3
A
Pulsed Drain Currenta
IDM
27
0.37
550
Linear Derating Factor
W/°C
mJ
A
Single Pulse Avalanche Energyb
Avalanche Currenta
EAS
IAR
6.8
Repetitive Avalanche Energya
EAR
4.6
mJ
W
Maximum Power Dissipation
TC = 25 °C
PD
46
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
24
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
300d
10
°C
for 10 s
lbf · in
N · m
Mounting Torque
6-32 or M3 screw
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 12).
b. Starting TJ = 25 °C, L = 24 mH, RG = 25 Ω, IAS = 6.8 A (see fig. 14).
c. ISD ≤ 6.8 A, dI/dt ≤ 650 A/µs, VDD ≤ VDS, dV/dt = 24 V/ns, TJ ≤ 150 °C.
d. 1.6 mm from case.
Document Number: 91177
S-Pending-Rev. A, 24-Jun-08
www.vishay.com
1
WORK-IN-PROGRESS