IRFIBC20G, SiHFIBC20G
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Isolated Package
600
Available
• High Voltage Isolation = 2.5 kVRMS (t = 60 s;
f = 60 Hz)
RDS(on) (Ω)
VGS = 10 V
4.4
RoHS*
Qg (Max.) (nC)
18
3.0
COMPLIANT
• Sink to Lead Creepage Distance = 4.8 mm
• Dynamic dV/dt Rating
Q
Q
gs (nC)
gd (nC)
8.9
• Low Thermal Resistance
Configuration
Single
• Lead (Pb)-free Available
D
TO-220 FULLPAK
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
G
The TO-220 FULLPAK eliminates the need for additional
insulating hardware in commercial-industrial applications.
The molding compound used provides a high isolation
capability and a low thermal resistance between the tab and
external heatsink. The isolation is equivalent to using a 100
micron mica barrier with standard TO-220 product. The
FULLPAK is mounted to a heatsink using a single clip or by
a single screw fixing.
S
N-Channel MOSFET
S
D
G
ORDERING INFORMATION
Package
TO-220 FULLPAK
IRFIBC20GPbF
SiHFIBC20G-E3
IRFIBC20G
Lead (Pb)-free
SnPb
SiHFIBC20G
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
600
V
VGS
20
TC = 25 °C
TC =100°C
1.7
Continuous Drain Current
V
GS at 10 V
ID
A
1.1
Pulsed Drain Currenta
IDM
6.8
Linear Derating Factor
0.24
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
84
1.7
EAR
3.0
mJ
W
Maximum Power Dissipation
Peak Diode Recovery dV/dtc
T
C = 25 °C
PD
30
3.0
dV/dt
TJ, Tstg
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
300d
°C
for 10 s
6-32 or M3 screw
10
lbf · in
N · m
Mounting Torque
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 53 mH, RG = 25 Ω, IAS = 1.7 A (see fig. 12).
c. ISD ≤ 2.2 A, dI/dt ≤ 40 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
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