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SIHFI840GLC PDF预览

SIHFI840GLC

更新时间: 2024-11-30 06:11:39
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威世 - VISHAY /
页数 文件大小 规格书
8页 1666K
描述
Power MOSFET

SIHFI840GLC 数据手册

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IRFI840GLC, SiHFI840GLC  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
• Ultra Low Gate Charge  
VDS (V)  
500  
• Reduced Gate Drive Requirement  
• Enhanced 30 V VGS Rating  
• Isolated Package  
Available  
R
DS(on) (Ω)  
VGS = 10 V  
0.85  
RoHS*  
Qg (Max.) (nC)  
39  
10  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
• High Voltage Isolation = 2.5 kVRMS (t = 60 s; f = 60 Hz)  
• Sink to Lead Creepage Distance = 4.8 mm  
• Repetitve Avalanche Rated  
19  
Configuration  
Single  
D
• Lead (Pb)-free Available  
TO-220 FULLPAK  
DESCRIPTION  
This new series of low charge Power MOSFETs achieve  
significantly lower gate charge over conventional MOSFETs.  
Utilizing advanced Power MOSFET technology, the device  
improvements allow for reduced gate drive requirements,  
faster switching speeds and increased total system savings.  
These device improvements combined with the proven  
ruggedness and reliability that are characteristic of  
MOSFETs offer the designer a new standard in power  
transistors for switching applications.  
G
S
D
G
S
N-Channel MOSFET  
The TO-220 FULLPAK eliminates the need for additional  
insulating hardware. The molding compound used provides  
a high isolation capability and low thermal resistance  
between the tab and external heatsink.  
ORDERING INFORMATION  
Package  
TO-220 FULLPAK  
IRFI840GLCPbF  
SiHFI840GLC-E3  
IRFI840GLC  
Lead (Pb)-free  
SnPb  
SiHFI840GLC  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
LIMIT  
500  
30  
UNIT  
VDS  
VGS  
V
T
C = 25 °C  
4.5  
2.9  
18  
Continuous Drain Current  
V
GS at 10 V  
ID  
A
TC =100°C  
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.32  
300  
4.5  
4.0  
40  
W/°C  
mJ  
A
mJ  
W
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
EAR  
PD  
dV/dt  
TJ, Tstg  
Maximum Power Dissipation  
Peak Diode Recovery dV/dtc  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TC = 25 °C  
3.5  
V/ns  
- 55 to + 150  
300d  
10  
°C  
for 10 s  
lbf · in  
N · m  
Mounting Torque  
6-32 or M3 screw  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 26 mH, RG = 25 Ω, IAS = 4.5 A (see fig. 12).  
c. ISD 8.0 A, dI/dt 100 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91160  
S-81292-Rev. A, 16-Jun-08  
www.vishay.com  
1

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