IRFI840GLC, SiHFI840GLC
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Ultra Low Gate Charge
VDS (V)
500
• Reduced Gate Drive Requirement
• Enhanced 30 V VGS Rating
• Isolated Package
Available
R
DS(on) (Ω)
VGS = 10 V
0.85
RoHS*
Qg (Max.) (nC)
39
10
COMPLIANT
Q
Q
gs (nC)
gd (nC)
• High Voltage Isolation = 2.5 kVRMS (t = 60 s; f = 60 Hz)
• Sink to Lead Creepage Distance = 4.8 mm
• Repetitve Avalanche Rated
19
Configuration
Single
D
• Lead (Pb)-free Available
TO-220 FULLPAK
DESCRIPTION
This new series of low charge Power MOSFETs achieve
significantly lower gate charge over conventional MOSFETs.
Utilizing advanced Power MOSFET technology, the device
improvements allow for reduced gate drive requirements,
faster switching speeds and increased total system savings.
These device improvements combined with the proven
ruggedness and reliability that are characteristic of
MOSFETs offer the designer a new standard in power
transistors for switching applications.
G
S
D
G
S
N-Channel MOSFET
The TO-220 FULLPAK eliminates the need for additional
insulating hardware. The molding compound used provides
a high isolation capability and low thermal resistance
between the tab and external heatsink.
ORDERING INFORMATION
Package
TO-220 FULLPAK
IRFI840GLCPbF
SiHFI840GLC-E3
IRFI840GLC
Lead (Pb)-free
SnPb
SiHFI840GLC
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
LIMIT
500
30
UNIT
VDS
VGS
V
T
C = 25 °C
4.5
2.9
18
Continuous Drain Current
V
GS at 10 V
ID
A
TC =100°C
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.32
300
4.5
4.0
40
W/°C
mJ
A
mJ
W
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
EAR
PD
dV/dt
TJ, Tstg
Maximum Power Dissipation
Peak Diode Recovery dV/dtc
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TC = 25 °C
3.5
V/ns
- 55 to + 150
300d
10
°C
for 10 s
lbf · in
N · m
Mounting Torque
6-32 or M3 screw
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 26 mH, RG = 25 Ω, IAS = 4.5 A (see fig. 12).
c. ISD ≤ 8.0 A, dI/dt ≤ 100 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91160
S-81292-Rev. A, 16-Jun-08
www.vishay.com
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