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SIHFBC40S-E3 PDF预览

SIHFBC40S-E3

更新时间: 2024-11-24 06:11:39
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 984K
描述
Power MOSFET

SIHFBC40S-E3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:4
Reach Compliance Code:unknownHTS代码:8541.29.00.95
风险等级:5.06Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):570 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:600 V最大漏极电流 (Abs) (ID):6.2 A
最大漏极电流 (ID):6.2 A最大漏源导通电阻:1.2 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):130 W最大脉冲漏极电流 (IDM):25 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SIHFBC40S-E3 数据手册

 浏览型号SIHFBC40S-E3的Datasheet PDF文件第2页浏览型号SIHFBC40S-E3的Datasheet PDF文件第3页浏览型号SIHFBC40S-E3的Datasheet PDF文件第4页浏览型号SIHFBC40S-E3的Datasheet PDF文件第5页浏览型号SIHFBC40S-E3的Datasheet PDF文件第6页浏览型号SIHFBC40S-E3的Datasheet PDF文件第7页 
IRFBC40S, IRFBC40L, SiHFBC40S, SiHFBC40L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Surface Mount (IRFBC40S/SiHFBC40S)  
PRODUCT SUMMARY  
VDS (V)  
600  
Available  
Low-Profile Through-Hole (IRFBC40L, SiHFBC40L)  
RDS(on) (Ω)  
VGS = 10 V  
1.2  
RoHS*  
• Available in Tape and Reel (IRFBC20S,  
SiHFBC20S)  
COMPLIANT  
Qg (Max.) (nC)  
60  
8.3  
Q
Q
gs (nC)  
gd (nC)  
• Dynamic dV/dt Rating  
• 150 °C Operating Temperature  
• Fast Switching  
30  
Configuration  
Single  
D
• Fully Avalanche Rated  
• Lead (Pb)-free Available  
D2PAK (TO-263)  
I2PAK (TO-262)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
The D2PAK is a surface mount power package capable of  
the accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK is suitable for high current applications because of its  
low internal connection resistance and can dissipate up to  
G
G
D
S
S
N-Channel MOSFET  
2.0  
W in a typical surface mount application. The  
through-hole version (IRFBC40L/SiHFBC40L) is available  
for low-profile applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
IRFBC40SPbF  
SiHFBC40S-E3  
IRFBC40S  
D2PAK (TO-263)  
IRFBC40STRLPbFa  
SiHFBC40STL-E3a  
IRFBC40STRLa  
I2PAK (TO-262)  
IRFBC40LPbF  
SiHFBC40L-E3  
IRFBC40L  
Lead (Pb)-free  
SnPb  
SiHFBC40S  
SiHFBC40STLa  
SiHFBC40L  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
600  
20  
UNIT  
Drain-Source Voltagee  
Gate-Source Voltagee  
VDS  
V
VGS  
TC = 25 °C  
6.2  
3.9  
25  
Continuous Drain Current  
VGS at 10 V  
ID  
TC = 100 °C  
A
Pulsed Drain Currenta,e  
IDM  
Linear Derating Factor  
1.0  
570  
6.2  
13  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb, e  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
EAR  
mJ  
T
C = 25 °C  
130  
3.1  
3.0  
Maximum Power Dissipation  
Peak Diode Recovery dV/dtc, e  
PD  
W
TA = 25 °C  
dV/dt  
V/ns  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91116  
S-Pending-Rev. A, 23-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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