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SIHB12N50C-E3 PDF预览

SIHB12N50C-E3

更新时间: 2024-11-24 09:25:35
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关测试脉冲局域网
页数 文件大小 规格书
8页 153K
描述
100 % Avalanche Tested Compliant to RoHS Directive 2002/95/EC

SIHB12N50C-E3 技术参数

是否无铅: 不含铅生命周期:Active
零件包装代码:D2PAK包装说明:SMALL OUTLINE, R-PSSO-G2
针数:4Reach Compliance Code:unknown
风险等级:5.37Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):180 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):12 A
最大漏极电流 (ID):12 A最大漏源导通电阻:0.555 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):208 W最大脉冲漏极电流 (IDM):28 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SIHB12N50C-E3 数据手册

 浏览型号SIHB12N50C-E3的Datasheet PDF文件第2页浏览型号SIHB12N50C-E3的Datasheet PDF文件第3页浏览型号SIHB12N50C-E3的Datasheet PDF文件第4页浏览型号SIHB12N50C-E3的Datasheet PDF文件第5页浏览型号SIHB12N50C-E3的Datasheet PDF文件第6页浏览型号SIHB12N50C-E3的Datasheet PDF文件第7页 
SiHP12N50C, SiHB12N50C, SiHF12N50C  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V) at TJ max.  
• Low Figure-of-Merit Ron x Qg  
560 V  
R
DS(on) (Ω)  
VGS = 10 V  
0.555  
• 100 % Avalanche Tested  
• Gate Charge Improved  
Qg (Max.) (nC)  
48  
12  
15  
Q
Q
gs (nC)  
gd (nC)  
• Trr/Qrr Improved  
Configuration  
Single  
• Compliant to RoHS Directive 2002/95/EC  
TO-220AB  
TO-220 FULLPAK  
D
S
D
S
D
G
G
G
D2PAK (TO-263)  
S
D
G
N-Channel MOSFET  
S
ORDERING INFORMATION  
Package  
TO-220AB  
D2PAK (TO-263)  
SiHB12N50C-E3  
TO-220 FULLPAK  
SiHF12N50C-E3  
Lead (Pb)-free  
SiHP12N50C-E3  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
LIMIT  
TO220-AB  
SYMBOL D2PAK (TO-263)  
TO-220  
FULLPAK  
PARAMETER  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
500  
30  
V
TC = 25 °C  
TC =100°C  
12  
Continuous Drain Current (TJ = 150 °C)a  
VGS at 10 V  
ID  
7.5  
28  
A
Pulsed Drain Currentc  
IDM  
Linear Derating Factor  
Single Pulse Avalanche Energyb  
1.67  
208  
0.28  
36  
W/°C  
mJ  
EAS  
PD  
180  
Maximum Power Dissipation  
W
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d  
TJ, Tstg  
- 55 to + 150  
300  
°C  
for 10 s  
Notes  
a. Limited by maximum junction temperature.  
b. VDD = 50 V, starting TJ = 25 °C, L = 2.5 mH, Rg = 25 Ω, IAS = 12 A.  
c. Repetitive rating; pulse width limited by maximum junction temperature.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91388  
S10-0969-Rev. B, 26-Apr-10  
www.vishay.com  
1

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