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SIC734CD9-T1 PDF预览

SIC734CD9-T1

更新时间: 2024-11-18 09:25:39
品牌 Logo 应用领域
威世 - VISHAY 驱动器MOSFET驱动器驱动程序和接口开关接口集成电路
页数 文件大小 规格书
10页 201K
描述
Fast Switching MOSFETs With Integrated Driver

SIC734CD9-T1 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:DFN包装说明:HVQCCN,
针数:32Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.4Is Samacsys:N
高边驱动器:YES接口集成电路类型:HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码:S-XQCC-N32JESD-609代码:e0
长度:9 mm功能数量:1
端子数量:32封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):240
认证状态:Not Qualified座面最大高度:0.9 mm
最大供电电压:5.5 V最小供电电压:4.5 V
标称供电电压:5 V电源电压1-最大:24 V
电源电压1-分钟:3.3 V电源电压1-Nom:12 V
表面贴装:YES端子面层:TIN LEAD
端子形式:NO LEAD端子节距:0.8 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
断开时间:0.031 µs接通时间:0.058 µs
宽度:9 mmBase Number Matches:1

SIC734CD9-T1 数据手册

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SiC734CD9  
Vishay Siliconix  
Fast Switching MOSFETs With Integrated Driver  
FEATURES  
PRODUCT SUMMARY  
Input Voltage Range  
Low-side MOSFET control pin for pre-bias start-up  
Undervoltage Lockout for safe operation  
Internal boostrap diode reduces  
component count  
3.3 to 24 V  
0.5 to 6 V  
100 kHz to 1 MHz  
Up to 25 A  
92.8  
Output Voltage Range  
Operating Frequency  
Continuous Output Current  
Peak Efficiency  
Break-Before-Make operation  
Turn-on/Turn-off Capability  
Compatible with any single or multi-phase PWM  
controller  
Low profile, thermally enhanced PowerPAK® MLF 9 x 9  
Package  
Optimized Duty Cycle Ratio  
10 %  
PowerPAK MLF 9 x 9  
APPLICATIONS  
DC-to-DC Point-of-Load Converters  
- 3.3 V, 5 V, or 12 V Intermediate BUS  
- Examples  
- 12 VIN/0.8 - 2.5 VOUT  
- 5 VIN/0.8 - 1.5 VOUT  
Servers and Computers  
Single and Multi-Phase Conversion  
Bottom View  
Ordering Information: SiC734CD9-T1  
DESCRIPTION  
The SiC734CD9 is an integrated solution which contains two  
PWM-optimized MOSFETs (high side and low side MOS-  
FETs) and a driver IC. Integrating the driver allows better op-  
timization of Power MOSFETs. This minimizes the losses  
and provides better performance at higher frequency. The  
SiC734CD9 is packed in Vishay Siliconix’s high performance  
PowerPAK MLF 9 x 9 package. Compact co-packing of com-  
ponents helps to reduce stray inductance, and hence in-  
creases efficiency.  
FUNCTIONAL BLOCK DIAGRAM  
C
BOOT  
V
DD  
V
IN  
UVLO  
SHDN  
+
-
BBM  
SW  
V
DD  
PWM  
SYNC  
CGND  
PGND  
Figure 1.  
Document Number: 73672  
S-62656–Rev. C, 25-Dec-06  
www.vishay.com  
1

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