Datasheet > SI7415DN-T1

SI7415DN-T1

更新时间： 2024-01-25 20:46:53

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威世 - VISHAY		/
页数	文件大小	规格书
5页	89K
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Transistor

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SI7415DN-T1 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
包装说明：	,	Reach Compliance Code：	compliant
ECCN代码：	EAR99	风险等级：	5.83
配置：	Single	最大漏极电流 (Abs) (ID)：	3.6 A
FET 技术：	METAL-OXIDE SEMICONDUCTOR	JESD-609代码：	e0
工作模式：	ENHANCEMENT MODE	最高工作温度：	150 °C
极性/信道类型：	P-CHANNEL	最大功率耗散 (Abs)：	3.8 W
子类别：	Other Transistors	表面贴装：	YES
端子面层：	Tin/Lead (Sn/Pb)	Base Number Matches：	1

SI7415DN-T1 数据手册

Si7415DN

Vishay Siliconix

P-Channel 60-V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

D TrenchFETr Power MOSFET

V_DS(V)

r_DS(on)(W)

I_D(A)

D New PowerPAKr Package

− Low Thermal Resistance, R_thJC

− Low 1.07-mm Profile

D Fast Switching

APPLICATIONS

0.065 @ V = −10 V

−5.7

−4.4

RoHS

COMPLIANT

Available

−60

0.110 @ V = −4.5

D Load Switches

D Half-Bridge Motor Drives

PowerPAK 1212-8

D High voltage Non-Synchronous Buck Converters

3.30 mm

Bottom View

Ordering Information: Si7415DN-T1

Si7415DN-T1—E3 (Lead (Pb)-Free)

P-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T = 25_C UNLESS OTHERWISE NOTED)

Parameter

Symbol

10 secs

Steady State

Unit

Drain-Source Voltage

Gate-Source Voltage

−60

"20

= 25_C

= 70_C

−3.6

−2.9

−5.7

−4.6

Continuous Drain Current (T = 150_C)

Pulsed Drain Current

−30

continuous Source Current (Diode Conduction)

−3.2

3.8

−1.3

1.5

= 25_C

= 70_C

Maximum Power Dissipation

2.0

0.8

Operating Junction and Storage Temperature Range

T , T

−55 to 150

stg

b,c

Soldering Recommendations (Peak Temperature)

260

THERMAL RESISTANCE RATINGS

Parameter

Symbol

Typical

Maximum

Unit

t v 10 sec

Steady State

Maximum Junction-to-Ambient

thJA

thJC

_C/W

Maximum Junction-to-Case (Drain)

1.9

2.4

Notes

a. Surface Mounted on 1” x 1” FR4 Board.

b. See Solder Profile (http://www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not

plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure

adequate bottom side solder interconnection.

c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

Document Number: 71691

S-51129—Rev. D, 13-Jun-05

www.vishay.com

12 3 4 5

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