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SFW9614 PDF预览

SFW9614

更新时间: 2024-11-04 22:21:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
7页 289K
描述
ADVANCED POWER MOSFET

SFW9614 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:D2PAK包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.92
Is Samacsys:N雪崩能效等级(Eas):112 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:250 V最大漏极电流 (Abs) (ID):1.6 A
最大漏极电流 (ID):1.6 A最大漏源导通电阻:4 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):20 W
最大脉冲漏极电流 (IDM):6.5 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SFW9614 数据手册

 浏览型号SFW9614的Datasheet PDF文件第2页浏览型号SFW9614的Datasheet PDF文件第3页浏览型号SFW9614的Datasheet PDF文件第4页浏览型号SFW9614的Datasheet PDF文件第5页浏览型号SFW9614的Datasheet PDF文件第6页浏览型号SFW9614的Datasheet PDF文件第7页 
SFW/I9614  
Advanced Power MOSFET  
FEATURES  
BVDSS = -250 V  
RDS(on) = 4.0   
ID = -1.6 A  
ν
ν
ν
ν
ν
ν
ν
Avalanche Rugged Technology  
Rugged Gate Oxide Technology  
Lower Input Capacitance  
Improved Gate Charge  
Extended Safe Operating Area  
Lower Leakage Current : 10 µA (Max.) @ VDS = -250V  
Low RDS(ON) : 3.5 (Typ.)  
D2-PAK  
I2-PAK  
2
1
1
2
3
3
1. Gate 2. Drain 3. Source  
Absolute Maximum Ratings  
Symbol  
Characteristic  
Value  
-250  
-1.6  
Units  
VDSS  
Drain-to-Source Voltage  
V
Continuous Drain Current (TC=25oC)  
Continuous Drain Current (TC=100oC)  
Drain Current-Pulsed  
ID  
A
-1.0  
IDM  
VGS  
EAS  
IAR  
1
-6.5  
A
V
O
+
_
30  
Gate-to-Source Voltage  
2
Single Pulsed Avalanche Energy  
Avalanche Current  
112  
-1.6  
2.0  
mJ  
A
O
1
O
EAR  
dv/dt  
Repetitive Avalanche Energy  
1
mJ  
V/ns  
W
O
3
Peak Diode Recovery dv/dt  
-4.8  
3.1  
O
o
*
Total Power Dissipation (TA=25 C)  
Total Power Dissipation (TC=25oC)  
Linear Derating Factor  
PD  
20  
W
W/oC  
0.16  
Operating Junction and  
TJ , TSTG  
- 55 to +150  
300  
Storage Temperature Range  
oC  
Maximum Lead Temp. for Soldering  
Purposes, 1/8“ from case for 5-seconds  
TL  
Thermal Resistance  
Symbol  
Characteristic  
Junction-to-Case  
Junction-to-Ambient  
Junction-to-Ambient  
Typ.  
Max.  
Units  
RθJC  
--  
--  
--  
6.25  
40  
oC/W  
RθJA  
RθJA  
*
62.5  
* When mounted on the minimum pad size recommended (PCB Mount).  
Rev. B1  
2001 Fairchild Semiconductor Corporation  

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