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S72WS256ND0KFWD33 PDF预览

S72WS256ND0KFWD33

更新时间: 2024-02-12 05:57:54
品牌 Logo 应用领域
飞索 - SPANSION 动态存储器内存集成电路
页数 文件大小 规格书
28页 1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA160, 15 X 15 MM, 1.25 MM HEIGHT, LEAD FREE, FBGA-160

S72WS256ND0KFWD33 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA,
针数:160Reach Compliance Code:compliant
HTS代码:8542.32.00.71风险等级:5.82
其他特性:MOBILE SDRAM IS ORGANIZED AS 2M X 16BIT X 4 BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLEJESD-30 代码:S-PBGA-B160
JESD-609代码:e1长度:15 mm
内存密度:268435456 bit内存集成电路类型:MEMORY CIRCUIT
内存宽度:16功能数量:1
端子数量:160字数:16777216 words
字数代码:16000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:16MX16封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1.25 mm
最大供电电压 (Vsup):1.95 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:0.65 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40宽度:15 mm

S72WS256ND0KFWD33 数据手册

 浏览型号S72WS256ND0KFWD33的Datasheet PDF文件第4页浏览型号S72WS256ND0KFWD33的Datasheet PDF文件第5页浏览型号S72WS256ND0KFWD33的Datasheet PDF文件第6页浏览型号S72WS256ND0KFWD33的Datasheet PDF文件第8页浏览型号S72WS256ND0KFWD33的Datasheet PDF文件第9页浏览型号S72WS256ND0KFWD33的Datasheet PDF文件第10页 
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
2. MCP Block Diagram  
2.1  
NOR Flash + ORNAND Flash + DRAM Products  
F-Vcc  
F-AVD#  
F-CLK  
AVD#  
CLK  
F-ACC  
ACC  
F-WP#  
F-RESET#  
F1-CE#  
F-WE#  
WP#  
RESET#  
CE#  
RDY  
DQ8:15  
DQ0:7  
RDY  
DQ8:15  
WE#  
OE#  
DQ0:7  
WS256N  
Vss  
F-OE#  
F-A23:A0  
F-VCCQ  
F2-CE#  
A23-A0  
CE#  
N-Vcc  
N-WP#  
N-CE#  
N-WE#  
N-RE#  
N-ALE  
N-CLE  
N-PRE  
WP#  
CE#  
WE#  
RE#  
ALE  
CLE  
PRE  
IO0:7  
MS01GP  
RY/BY#  
RY/BY#  
Vss  
D-Vcc  
V-Vccq  
A12-A0  
CE#  
D-A12-A0  
D-CE#  
DQ0:15  
D-DQ15-DQ0  
WE#  
BA0  
D-WE#  
D-BA0  
BA1  
CKE  
RAS#  
CAS#  
DM0  
DM1  
D-BA1  
D-CKE  
D-RAS#  
D-CAS#  
D-DM0  
D-DM1  
SDRAM  
D-Vss  
D-Vssq  
Notes  
1. For a one-Flash configuration, F1-CE# = CE#.  
For a two-Flash configuration, F1-CE# = CE for Flash 1 and F2-CE# = CE for Flash 2; F2-CE# is the chip-enable pin for the second Flash.  
2. If ORNAND is not present in the MCP, then the MS01GP block will not be present in the figure above. In that case, the common signals  
go only to the WS256N flash, while the SDRAM signals remain unchanged.  
3. If ORNAND supports a x16 bus, then NOR DQ0-DQ15 is shared with ORNAND I/O0-I/O15.  
May 8, 2007 S72WS-N_00_A9  
S72WS-N Based MCP/PoP Products  
7

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