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Q67050-A4174-A001 PDF预览

Q67050-A4174-A001

更新时间: 2024-01-01 17:30:53
品牌 Logo 应用领域
英飞凌 - INFINEON 二极管开关
页数 文件大小 规格书
4页 66K
描述
Fast switching diode chip in EMCON 3 -Technology

Q67050-A4174-A001 数据手册

 浏览型号Q67050-A4174-A001的Datasheet PDF文件第2页浏览型号Q67050-A4174-A001的Datasheet PDF文件第3页浏览型号Q67050-A4174-A001的Datasheet PDF文件第4页 
SIDC32D170H  
Fast switching diode chip in EMCON 3-Technology  
A
FEATURES:  
This chip is used for:  
·
·
·
·
1700V EMCON 3 technology 200 µm chip  
soft, fast switching  
low reverse recovery charge  
small temperature coefficient  
·
EUPEC power modules  
C
Applications:  
·
resonant applications, drives  
Chip Type  
VR  
IF  
Die Size  
5.7 x 5.7 mm2  
Package  
Ordering Code  
Q67050-A4174-  
A001  
SIDC32D170H  
1700V 50A  
sawn on foil  
MECHANICAL PARAMETER:  
Raster size  
5.7 x 5.7  
32.49 / 22.41  
3.68 x 3.68  
200  
mm2  
Area total / active  
Anode pad size  
Thickness  
µm  
mm  
deg  
Wafer size  
150  
Flat position  
180  
Max. possible chips per wafer  
Passivation frontside  
Anode metallization  
442 pcs  
Photoimide  
3200 nm Al Si Cu  
Ni Ag –system  
Cathode metallization  
Die bond  
suitable for epoxy and soft solder die bonding  
electrically conductive glue or solder  
Wire bond  
Al, £500µm  
Reject Ink Dot Size  
Æ 0.65mm; max 1.2mm  
store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended Storage Environment  
Edited by INFINEON Technologies AI DP PSD CLS, L 4461A, Edition 2, 02.11.2004  

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