是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | TSSOP | 包装说明: | 4.40 MM WIDTH, PLASTIC, MO-153, SOT403-1, TSSOP-16 |
针数: | 16 | Reach Compliance Code: | compliant |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.55 |
Is Samacsys: | N | JESD-30 代码: | R-PDSO-G16 |
JESD-609代码: | e4 | 长度: | 5 mm |
湿度敏感等级: | 1 | 端子数量: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
最大供电电压: | 5.5 V | 最小供电电压: | 2.3 V |
标称供电电压: | 3.6 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
宽度: | 4.4 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT |
Base Number Matches: | 1 |
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