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PCA9508D

更新时间： 2024-02-21 15:09:44

品牌	Logo	应用领域
恩智浦 - NXP		驱动程序和接口接口集成电路中继器光电二极管
页数	文件大小	规格书
21页	135K
描述
Hot swappable level translating I2C-bus repeater

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技术参数
数据手册

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PCA9508D 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	SOP, SOP8,.25	Reach Compliance Code：	unknown
风险等级：	5.83	JESD-30 代码：	R-PDSO-G8
端子数量：	8	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP	封装等效代码：	SOP8,.25
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
电源：	3/5 V	认证状态：	Not Qualified
子类别：	Line Driver or Receivers	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子形式：	GULL WING	端子节距：	1.27 mm
端子位置：	DUAL	Base Number Matches：	1

PCA9508D 数据手册

PCA9508

NXP Semiconductors

Hot swappable level translating I²C-bus repeater

13.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 18) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 7 and 8

Table 7.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

≥ 350

220

< 2.5

235

220

≥ 2.5

220

Table 8.

Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 18.

PCA9508_1

Product data sheet

Rev. 01 — 28 April 2008

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