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PCA9508D

更新时间： 2024-02-19 10:12:25

品牌	Logo	应用领域
恩智浦 - NXP		驱动程序和接口接口集成电路中继器光电二极管
页数	文件大小	规格书
21页	135K
描述
Hot swappable level translating I2C-bus repeater

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PCA9508D 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	SOP, SOP8,.25	Reach Compliance Code：	unknown
风险等级：	5.83	JESD-30 代码：	R-PDSO-G8
端子数量：	8	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP	封装等效代码：	SOP8,.25
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
电源：	3/5 V	认证状态：	Not Qualified
子类别：	Line Driver or Receivers	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子形式：	GULL WING	端子节距：	1.27 mm
端子位置：	DUAL	Base Number Matches：	1

PCA9508D 数据手册

PCA9508

NXP Semiconductors

Hot swappable level translating I²C-bus repeater

13. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reﬂow

soldering description”.

13.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

13.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

• Board speciﬁcations, including the board ﬁnish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

13.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath speciﬁcations, including temperature and impurities

PCA9508_1

Product data sheet

Rev. 01 — 28 April 2008

17 of 21

1...14 15 161718 19 20 21

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与PCA9508D相关器件

型号	品牌	描述	获取价格	数据表
PCA9508D,112	NXP	PCA9508 - Hot swappable level translating I2C-bus repeater SOIC 8-Pin	获取价格
PCA9508D,118	NXP	PCA9508 - Hot swappable level translating I2C-bus repeater SOIC 8-Pin	获取价格
PCA9508DP	NXP	Hot swappable level translating I2C-bus repeater	获取价格
PCA9508DP,118	NXP	PCA9508 - Hot swappable level translating I2C-bus repeater TSSOP 8-Pin	获取价格
PCA9508DP-T	NXP	IC,REPEATER INTERFACE,CMOS,TSSOP,8PIN,PLASTIC	获取价格
PCA9508D-T	NXP	IC,REPEATER INTERFACE,CMOS,SOP,8PIN,PLASTIC	获取价格

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