NVTFS4C13N
Power MOSFET
30 V, 9.4 mW, 40 A, Single N−Channel,
m8FL
Features
• Low R
to Minimize Conduction Losses
DS(on)
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• NVTFS4C13NWF − Wettable Flanks Product
• NVT Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
www.onsemi.com
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
9.4 mW @ 10 V
14 mW @ 4.5 V
30 V
40 A
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
D (5,6)
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol Value Unit
V
30
20
14
V
V
A
DSS
G (4)
Gate−to−Source Voltage
V
GS
Continuous Drain
Current R
T = 25°C
I
D
A
S (1,2,3)
N−CHANNEL MOSFET
q
JA
T = 100°C
A
10
(Notes 1, 2, 4)
T = 25°C
P
3.0
1.5
40
W
Power Dissipation R
(Note 1, 2, 4)
q
A
D
JA
MARKING DIAGRAM
T = 100°C
A
Steady
State
1
Continuous Drain
T
C
= 25°C
I
D
1
S
S
S
G
D
D
D
D
Current R
3, 4)
(Note 1,
q
JC
XXXX
AYWWG
G
T
C
= 100°C
28
A
WDFN8
(m8FL)
CASE 511AB
Power Dissipation
(Note 1, 3, 4)
T
= 25°C
P
D
26
13
W
C
R
q
JC
T
C
= 100°C
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
152
A
A
p
4C13
= Specific Device Code for
NVMTS4C13N
Operating Junction and Storage Temperature
T ,
−55 to
+175
°C
J
stg
T
13WF = Specific Device Code of
NVTFS4C13NWF
A
Source Current (Body Diode)
I
S
24
10
A
= Assembly Location
= Year
= Work Week
Single Pulse Drain−to−Source Avalanche Energy
E
AS
mJ
Y
(T = 25°C, I = 14 A , L = 0.1 mH)
J
L
pk
WW
G
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
= Pb−Free Package
(Note: Microdot may be in either location)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
THERMAL RESISTANCE MAXIMUM RATINGS
See detailed ordering and shipping information on page 5 of
this data sheet.
Parameter
Symbol
Value
Unit
Junction−to−Case − Steady State (Drain)
(Notes 1 and 4)
R
5.8
q
JC
°C/W
Junction−to−Ambient – Steady State
(Notes 1 and 2)
R
50
q
JA
1. The entire application environment impacts the thermal resistance values
shown, they are not constants and are only valid for the particular conditions
noted.
2
2. Surface−mounted on FR4 board using a 650 mm 2 oz. Cu pad.
3. Assumes heat−sink sufficiently large to maintain constant case temperature
independent of device power.
4. Continuous DC current rating. Maximum current for pulses as long as
1 second is higher but is dependent on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
January, 2017 − Rev. 2
NVTFS4C13N/D