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NVTFS4C13N_17 PDF预览

NVTFS4C13N_17

更新时间: 2024-11-10 01:01:51
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安森美 - ONSEMI /
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6页 89K
描述
Power MOSFET

NVTFS4C13N_17 数据手册

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NVTFS4C13N  
Power MOSFET  
30 V, 9.4 mW, 40 A, Single N−Channel,  
m8FL  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
NVTFS4C13NWF − Wettable Flanks Product  
NVT Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
www.onsemi.com  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
9.4 mW @ 10 V  
14 mW @ 4.5 V  
30 V  
40 A  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
D (5,6)  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain−to−Source Voltage  
Symbol Value Unit  
V
30  
20  
14  
V
V
A
DSS  
G (4)  
Gate−to−Source Voltage  
V
GS  
Continuous Drain  
Current R  
T = 25°C  
I
D
A
S (1,2,3)  
N−CHANNEL MOSFET  
q
JA  
T = 100°C  
A
10  
(Notes 1, 2, 4)  
T = 25°C  
P
3.0  
1.5  
40  
W
Power Dissipation R  
(Note 1, 2, 4)  
q
A
D
JA  
MARKING DIAGRAM  
T = 100°C  
A
Steady  
State  
1
Continuous Drain  
T
C
= 25°C  
I
D
1
S
S
S
G
D
D
D
D
Current R  
3, 4)  
(Note 1,  
q
JC  
XXXX  
AYWWG  
G
T
C
= 100°C  
28  
A
WDFN8  
(m8FL)  
CASE 511AB  
Power Dissipation  
(Note 1, 3, 4)  
T
= 25°C  
P
D
26  
13  
W
C
R
q
JC  
T
C
= 100°C  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
152  
A
A
p
4C13  
= Specific Device Code for  
NVMTS4C13N  
Operating Junction and Storage Temperature  
T ,  
−55 to  
+175  
°C  
J
stg  
T
13WF = Specific Device Code of  
NVTFS4C13NWF  
A
Source Current (Body Diode)  
I
S
24  
10  
A
= Assembly Location  
= Year  
= Work Week  
Single Pulse Drain−to−Source Avalanche Energy  
E
AS  
mJ  
Y
(T = 25°C, I = 14 A , L = 0.1 mH)  
J
L
pk  
WW  
G
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
= Pb−Free Package  
(Note: Microdot may be in either location)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
THERMAL RESISTANCE MAXIMUM RATINGS  
See detailed ordering and shipping information on page 5 of  
this data sheet.  
Parameter  
Symbol  
Value  
Unit  
Junction−to−Case − Steady State (Drain)  
(Notes 1 and 4)  
R
5.8  
q
JC  
°C/W  
Junction−to−Ambient – Steady State  
(Notes 1 and 2)  
R
50  
q
JA  
1. The entire application environment impacts the thermal resistance values  
shown, they are not constants and are only valid for the particular conditions  
noted.  
2
2. Surface−mounted on FR4 board using a 650 mm 2 oz. Cu pad.  
3. Assumes heat−sink sufficiently large to maintain constant case temperature  
independent of device power.  
4. Continuous DC current rating. Maximum current for pulses as long as  
1 second is higher but is dependent on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
January, 2017 − Rev. 2  
NVTFS4C13N/D  
 

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