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NUF8001MU PDF预览

NUF8001MU

更新时间: 2024-09-15 03:45:47
品牌 Logo 应用领域
安森美 - ONSEMI 过滤器
页数 文件大小 规格书
4页 63K
描述
Low Capacitance 8 Line EMI Filter with ESD Protection in UDFN Package

NUF8001MU 数据手册

 浏览型号NUF8001MU的Datasheet PDF文件第2页浏览型号NUF8001MU的Datasheet PDF文件第3页浏览型号NUF8001MU的Datasheet PDF文件第4页 
NUF8001MU  
Low Capacitance 8 Line EMI  
Filter with ESD Protection in  
UDFN Package  
This device is an 8 line EMI filter array for wireless applications.  
Greater than −25 dB attenuation is obtained at frequencies from 800 MHz  
to 5.0 GHz. The NUF8001MU has a cut−off frequency of 160 MHz and  
can be used in applications for data rate up to 60 MHz or 120 Mbps. This  
UDFN package is specifically designed to enhance EMI filtering for  
low−profile or slim design electronics especially where space and height  
is a premium. It also offers ESD protection−clamping transients from  
static discharges. ESD protection is provided across all capacitors.  
http://onsemi.com  
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Features  
EMI Filtering and ESD Protection  
Integration of 40 Discrete Components  
Compliance with IEC61000−4−2 (Level 4): > 12 kV (Contact)  
UDFN Package, 1.2 x 3.5 mm, 0.4 mm Pitch  
Moisture Sensitivity Level 1  
ESD Ratings: Machine Model = C  
Human Body Model = 3B  
This is a Pb−Free Device*  
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10  
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Benefits  
Reduces EMI/RFI Emmisions on a Data Line  
Low Profile Package; Typical Height of 0.5 mm  
Design−Friendly and Easy−to−Use Pin Configurations,  
Particularly for Portable Electronics  
Integrated Solution Offers Cost and Space Savings in UDFN Package  
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass  
Filter Response  
Integrated Solution Improves System Reliability  
(Top View)  
16  
MARKING  
DIAGRAM  
1
1
Applications  
UDFN16  
MU SUFFIX  
CASE 517AF  
801  
AYW  
G
EMI Filtering and ESD Protection for Data Lines  
Keypad Interface and Protection for Portable Electronics  
Bottom Connector Interface for Mobile Handsets  
Notebook Computers and Digital Cameras  
LCD Display Interface in Mobile Handsets  
Camera Display Interface in Mobile Handsets  
801 = Specific Device Code  
A
Y
W
G
= Assembly Location  
= Year  
= Work Week  
= Pb−Free Package  
ORDERING INFORMATION  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Device  
Package  
Shipping  
3000 / Tape & Reel  
NUF8001MUT2G UDFN16  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
August, 2006 − Rev. 0  
NUF8001MU/D  

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