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NUF6406MN PDF预览

NUF6406MN

更新时间: 2024-09-14 03:45:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 54K
描述
Low Capacitance 6 Line EMI Filter with ESD Protection

NUF6406MN 数据手册

 浏览型号NUF6406MN的Datasheet PDF文件第2页浏览型号NUF6406MN的Datasheet PDF文件第3页浏览型号NUF6406MN的Datasheet PDF文件第4页 
NUF6406MN  
Low Capacitance 6 Line  
EMI Filter with ESD  
Protection  
This device is a 6 line EMI filter array for wireless applications.  
Greater than −30 dB attenuation is obtained at frequencies from  
800 MHz to 2.4 GHz. It also offers ESD protection−clamping  
transients from static discharges. ESD protection is provided across all  
capacitors.  
http://onsemi.com  
1
2
3
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12  
11  
10  
9
Cd Cd  
Features  
EMI Filtering and ESD Protection  
Integration of 30 Discrete Components  
Compliance with IEC61000−4−2 (Level 4)  
> 8.0 kV (Contact)  
Cd Cd  
Cd Cd  
Cd Cd  
Cd Cd  
DFN Package, 1.35 x 3.0 mm  
Moisture Sensitivity Level 1  
ESD Ratings:  
Machine Model = C  
Human Body Model = 3B  
This is a Pb−Free Device*  
Benefits  
8
Reduces EMI/RFI Emissions on a Data Line  
Integrated Solution Offers Cost and Space Savings in a DFN Package  
7
Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass  
Cd Cd  
Filter Response  
Integrated Solution Improves System Reliability  
Compatible Footprint to BGA or Flip−Chip Package  
Applications  
(Top View)  
MARKING  
DIAGRAM  
EMI Filtering and ESD Protection for Data Lines  
Wireless Phones  
PDAs and Handheld Products  
Notebook Computers  
LCD Displays  
12  
1
64  
06  
MG  
G
1
DFN12  
CASE 506AD  
1
2
3
4
5
6
6406 = Specific Device Code  
M
= Month  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
GND  
ORDERING INFORMATION  
12  
11  
10  
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7
Device  
NUF6406MNT1G  
Package  
Shipping  
(Bottom View)  
DFN12  
3000 / Tape & Reel  
(Pb−Free)  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
June, 2005 − Rev. 2  
NUF6406MN/D  

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