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NSBC114EPDXV6_04 PDF预览

NSBC114EPDXV6_04

更新时间: 2024-02-08 18:20:56
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
14页 175K
描述
Dual Bias Resistor Transistors

NSBC114EPDXV6_04 数据手册

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NSBC114EPDXV6T1,  
NSBC114EPDXV6T5  
Preferred Devices  
Dual Bias Resistor  
Transistors  
NPN and PNP Silicon Surface Mount  
Transistors with Monolithic Bias  
Resistor Network  
http://onsemi.com  
(3)  
(2)  
(1)  
R
The BRT (Bias Resistor Transistor) contains a single transistor with  
a monolithic bias network consisting of two resistors; a series base  
resistor and a base−emitter resistor. These digital transistors are  
designed to replace a single device and its external resistor bias  
network. The BRT eliminates these individual components by  
integrating them into a single device. In the NSBC114EPDXV6T1  
series, two complementary BRT devices are housed in the SOT−563  
package which is ideal for low power surface mount applications  
where board space is at a premium.  
1
R
2
Q
1
Q
2
R
2
R
1
(4)  
(5)  
(6)  
4
5
6
Simplifies Circuit Design  
Reduces Board Space  
Reduces Component Count  
Available in 8 mm, 7 inch Tape and Reel  
Lead Free Solder Plating  
3
2
1
SOT−563  
CASE 463A  
PLASTIC  
MARKING DIAGRAM  
MAXIMUM RATINGS (T = 25°C unless otherwise noted, common for Q  
A
1
and Q , − minus sign for Q (PNP) omitted)  
2
1
Rating  
Symbol  
Value  
50  
Unit  
xx D  
Collector-Base Voltage  
Collector-Emitter Voltage  
Collector Current  
V
CBO  
V
CEO  
Vdc  
Vdc  
50  
xx = Specific Device Code  
(see table on page 2)  
I
C
100  
mAdc  
THERMAL CHARACTERISTICS  
D
= Date Code  
Characteristic  
(One Junction Heated)  
Symbol  
Max  
Unit  
ORDERING INFORMATION  
Total Device Dissipation  
T = 25°C  
P
D
357  
(Note 1)  
2.9  
mW  
A
Device  
Package  
Shipping  
Derate above 25°C  
mW/°C  
°C/W  
(Note 1)  
NSBC114EPDXV6T1 SOT−563  
4 mm pitch  
4000/Tape & Reel  
Thermal Resistance Junction-to-Ambient  
R
350  
q
JA  
(Note 1)  
NSBC114EPDXV6T5 SOT−563  
2 mm pitch  
8000/Tape & Reel  
Characteristic  
(Both Junctions Heated)  
Symbol  
Max  
Unit  
Total Device Dissipation  
T = 25°C  
P
500  
(Note 1)  
4.0  
mW  
A
D
DEVICE MARKING INFORMATION  
Derate above 25°C  
mW/°C  
°C/W  
°C  
See specific marking information in the device marking table  
on page 2 of this data sheet.  
(Note 1)  
Thermal Resistance Junction-to-Ambient  
Junction and Storage Temperature  
1. FR−4 @ Minimum Pad  
R
250  
(Note 1)  
q
JA  
Preferred devices are recommended choices for future use  
and best overall value.  
T , T  
J
55 to  
+150  
stg  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
January, 2004 − Rev. 3  
NSBC114EPDXV6/D  
 

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